Diffusion bonding of Cu atoms with molecular dynamics simulations

Diffusion bonding of Cu atoms with molecular dynamics simulations

Diffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of press...

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Bibliographic Details
Main Authors: A. Xydou, S. Parviainen, F. Djurabekova
Format: Article
Language:English
Published: Elsevier 2020-03-01
Series:Results in Physics
Subjects:
CLIC
Cu
Molecular dynamics
Diffusion bonding
High temperature
Online Access:http://www.sciencedirect.com/science/article/pii/S2211379719330116
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spelling doaj-38fe67a7ac2b4d9c9ebae5522c0dfa922020-11-25T03:18:47ZengElsevierResults in Physics2211-37972020-03-0116102890Diffusion bonding of Cu atoms with molecular dynamics simulationsA. Xydou0S. Parviainen1F. Djurabekova2CERN, European Organization for Nuclear Research, Switzerland; MEAD, Mechanical Engineering and Aeronautics Department, University of Patras, Greece; Corresponding author at: CERN, European Organization for Nuclear Research, Switzerland.Helsinki Institute of Physics and Department of Physics, P.O. Box 43, 00014, University of Helsinki, FinlandHelsinki Institute of Physics and Department of Physics, P.O. Box 43, 00014, University of Helsinki, Finland; Department of Plasma Physics, National Research Nuclear University MEPHI, 31 Moscow, RussiaDiffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of pressure and temperature will enable an accurate design of manufacturing workflow and machining tolerances. However, required optimization is not possible without good understanding of physical processes developed in copper under pressure and high temperature. In this work, the combined effect of temperature and pressure on closing time of inter-granular voids is examined by means of molecular dynamics simulations. In particular, a nano-void of 3.5–5.5 nm in diameter representing a peak and a valley of surface roughness facing each other was inserted between identical copper grains. The simulations performed at T = 1250 K, the temperature used in experimental condition, and the 300–800 MPa pressure range indicated the dislocation-mediated enhancement of atomic diffusion leading to full void closure.http://www.sciencedirect.com/science/article/pii/S2211379719330116CLICCuMolecular dynamicsDiffusion bondingHigh temperature
collection DOAJ
language English
format Article
sources DOAJ
author A. Xydou
S. Parviainen
F. Djurabekova
spellingShingle A. Xydou
S. Parviainen
F. Djurabekova
Diffusion bonding of Cu atoms with molecular dynamics simulations
Results in Physics
CLIC
Cu
Molecular dynamics
Diffusion bonding
High temperature
author_facet A. Xydou
S. Parviainen
F. Djurabekova
author_sort A. Xydou
title Diffusion bonding of Cu atoms with molecular dynamics simulations
title_short Diffusion bonding of Cu atoms with molecular dynamics simulations
title_full Diffusion bonding of Cu atoms with molecular dynamics simulations
title_fullStr Diffusion bonding of Cu atoms with molecular dynamics simulations
title_full_unstemmed Diffusion bonding of Cu atoms with molecular dynamics simulations
title_sort diffusion bonding of cu atoms with molecular dynamics simulations
publisher Elsevier
series Results in Physics
issn 2211-3797
publishDate 2020-03-01
description Diffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of pressure and temperature will enable an accurate design of manufacturing workflow and machining tolerances. However, required optimization is not possible without good understanding of physical processes developed in copper under pressure and high temperature. In this work, the combined effect of temperature and pressure on closing time of inter-granular voids is examined by means of molecular dynamics simulations. In particular, a nano-void of 3.5–5.5 nm in diameter representing a peak and a valley of surface roughness facing each other was inserted between identical copper grains. The simulations performed at T = 1250 K, the temperature used in experimental condition, and the 300–800 MPa pressure range indicated the dislocation-mediated enhancement of atomic diffusion leading to full void closure.
topic CLIC
Cu
Molecular dynamics
Diffusion bonding
High temperature
url http://www.sciencedirect.com/science/article/pii/S2211379719330116
work_keys_str_mv AT axydou diffusionbondingofcuatomswithmoleculardynamicssimulations
AT sparviainen diffusionbondingofcuatomswithmoleculardynamicssimulations
AT fdjurabekova diffusionbondingofcuatomswithmoleculardynamicssimulations
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