Diffusion bonding of Cu atoms with molecular dynamics simulations

Diffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of press...

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Bibliographic Details
Main Authors: A. Xydou, S. Parviainen, F. Djurabekova
Format: Article
Language:English
Published: Elsevier 2020-03-01
Series:Results in Physics
Subjects:
Cu
Online Access:http://www.sciencedirect.com/science/article/pii/S2211379719330116