Diffusion bonding of Cu atoms with molecular dynamics simulations
Diffusion bonding of copper disks is an important step during the assembly of accelerating structures -the main components of power radio-frequency linear accelerators-. During the diffusion bonding copper disks are subjected to pressure at high temperatures. Finding the optimal combination of press...
Main Authors: | A. Xydou, S. Parviainen, F. Djurabekova |
---|---|
Format: | Article |
Language: | English |
Published: |
Elsevier
2020-03-01
|
Series: | Results in Physics |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379719330116 |
Similar Items
-
Atomic insights of Cu nanoparticles melting and sintering behavior in CuCu direct bonding
by: Rui Wu, et al.
Published: (2021-01-01) -
Molecular Dynamics Simulations of Atomic Diffusion during the Al–Cu Ultrasonic Welding Process
by: Jingwei Yang, et al.
Published: (2019-07-01) -
The diffusion behaviors at the Cu-Al solid-liquid interface: A molecular dynamics study
by: Aixia Mao, et al.
Published: (2020-03-01) -
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
by: Jing-Ye Juang, et al.
Published: (2018-11-01) -
Performance of Cu–Ag Thin Films as Diffusion Barrier Layer
by: Po-Hsien Sung, et al.
Published: (2020-11-01)