Development of microforming process combined with thin film transfer printing

• Main Authors: Koshimizu Kazushi, Zheng Qiu, Shimizu Tetsuhide, Yang Ming
• Format: Article
• Language: English
• Published: EDP Sciences 2015-01-01
• Series: Manufacturing Review
• Subjects: Microforming; Transfer printing; Ti foils; Au thin films; Micro bulging
• Online Access: http://dx.doi.org/10.1051/mfreview/2015009

Microforming receives a lot of attentions in the recent years due to the increased use of microparts in electronics and medical sectors. For the further functionalization of these micro devices, high functional surface with noble metals are strongly required for the devices in bio- and medical fields, such as bio-sensors. To realize the submillimeter structure of metal foils and micro to nanometer structures in one forming process, the present study proposes a combined process of microforming for metal foils and transfer printing of gold (Au) thin films. To clarify the availability of the proposed combined process, transferability of Au thin films under micro bulging deformation are investigated. 0.1 mm-thick pure titanium (Ti) foils and 100 nm-thick Au films were used as blank and functional materials, respectively. The forming tests of the proposed process were conducted. With increasing strain of Ti foils, Au TP areas increase. By this experiment, it’s confirmed that the hydrogen reduction of oxidation layers and the strain of Ti foil are significant factor for Au TP on Ti foils.