ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition
For the analysis of thin films, with high aspect ratio (HAR) structures, time-of-flight secondary ion mass spectrometry (ToF-SIMS) overcomes several challenges in comparison to other frequently used techniques such as electron microscopy. The research presented herein focuses on two different kinds...
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doaj-3b3ab12bf8c5409e8c9423ad6d8abcd12020-11-24T20:44:10ZengMDPI AGNanomaterials2079-49912019-07-0197103510.3390/nano9071035nano9071035ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor DepositionAlireza M. Kia0Nora Haufe1Sajjad Esmaeili2Clemens Mart3Mikko Utriainen4Riikka L. Puurunen5Wenke Weinreich6Fraunhofer Institute for Photonic Microsystems, 01099 Dresden, GermanyFraunhofer Institute for Photonic Microsystems, 01099 Dresden, GermanyFraunhofer Institute for Photonic Microsystems, 01099 Dresden, GermanyFraunhofer Institute for Photonic Microsystems, 01099 Dresden, GermanyVTT Technical Research Centre of Finland Ltd., 02044 Espoo, FinlandVTT Technical Research Centre of Finland Ltd., 02044 Espoo, FinlandFraunhofer Institute for Photonic Microsystems, 01099 Dresden, GermanyFor the analysis of thin films, with high aspect ratio (HAR) structures, time-of-flight secondary ion mass spectrometry (ToF-SIMS) overcomes several challenges in comparison to other frequently used techniques such as electron microscopy. The research presented herein focuses on two different kinds of HAR structures that represent different semiconductor technologies. In the first study, ToF-SIMS is used to illustrate cobalt seed layer corrosion by the copper electrolyte within the large through-silicon-vias (TSVs) before and after copper electroplating. However, due to the sample’s surface topography, ToF-SIMS analysis proved to be difficult due to the geometrical shadowing effects. Henceforth, in the second study, we introduce a new test platform to eliminate the difficulties with the HAR structures, and again, use ToF-SIMS for elemental analysis. We use data image slicing of 3D ToF-SIMS analysis combined with lateral HAR test chips (PillarHall™) to study the uniformity of silicon dopant concentration in atomic layer deposited (ALD) HfO<sub>2</sub> thin films.https://www.mdpi.com/2079-4991/9/7/1035ToF-SIMS 3D imagingcompositional depth profilinghigh aspect ratio (HAR) structuressilicon doped hafnium oxide (HSO) ALD depositionlateral high aspect ratio (LHAR)ToF-SIMS analysis |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Alireza M. Kia Nora Haufe Sajjad Esmaeili Clemens Mart Mikko Utriainen Riikka L. Puurunen Wenke Weinreich |
spellingShingle |
Alireza M. Kia Nora Haufe Sajjad Esmaeili Clemens Mart Mikko Utriainen Riikka L. Puurunen Wenke Weinreich ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition Nanomaterials ToF-SIMS 3D imaging compositional depth profiling high aspect ratio (HAR) structures silicon doped hafnium oxide (HSO) ALD deposition lateral high aspect ratio (LHAR) ToF-SIMS analysis |
author_facet |
Alireza M. Kia Nora Haufe Sajjad Esmaeili Clemens Mart Mikko Utriainen Riikka L. Puurunen Wenke Weinreich |
author_sort |
Alireza M. Kia |
title |
ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition |
title_short |
ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition |
title_full |
ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition |
title_fullStr |
ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition |
title_full_unstemmed |
ToF-SIMS 3D Analysis of Thin Films Deposited in High Aspect Ratio Structures via Atomic Layer Deposition and Chemical Vapor Deposition |
title_sort |
tof-sims 3d analysis of thin films deposited in high aspect ratio structures via atomic layer deposition and chemical vapor deposition |
publisher |
MDPI AG |
series |
Nanomaterials |
issn |
2079-4991 |
publishDate |
2019-07-01 |
description |
For the analysis of thin films, with high aspect ratio (HAR) structures, time-of-flight secondary ion mass spectrometry (ToF-SIMS) overcomes several challenges in comparison to other frequently used techniques such as electron microscopy. The research presented herein focuses on two different kinds of HAR structures that represent different semiconductor technologies. In the first study, ToF-SIMS is used to illustrate cobalt seed layer corrosion by the copper electrolyte within the large through-silicon-vias (TSVs) before and after copper electroplating. However, due to the sample’s surface topography, ToF-SIMS analysis proved to be difficult due to the geometrical shadowing effects. Henceforth, in the second study, we introduce a new test platform to eliminate the difficulties with the HAR structures, and again, use ToF-SIMS for elemental analysis. We use data image slicing of 3D ToF-SIMS analysis combined with lateral HAR test chips (PillarHall™) to study the uniformity of silicon dopant concentration in atomic layer deposited (ALD) HfO<sub>2</sub> thin films. |
topic |
ToF-SIMS 3D imaging compositional depth profiling high aspect ratio (HAR) structures silicon doped hafnium oxide (HSO) ALD deposition lateral high aspect ratio (LHAR) ToF-SIMS analysis |
url |
https://www.mdpi.com/2079-4991/9/7/1035 |
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