Effect of In-Incorporation and Annealing on Cu<sub>x</sub>Se Thin Films

A study of indium-incorporated copper selenide thin-film deposition on a glass substrate using the successive ionic adsorption and reaction method (SILAR) and the resulting properties is presented. The films were formed using these steps: selenization in the solution of diseleniumtetrathionate acid,...

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Bibliographic Details
Main Authors: Algimantas Ivanauskas, Remigijus Ivanauskas, Ingrida Ancutiene
Format: Article
Language:English
Published: MDPI AG 2021-07-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/14/14/3810
Description
Summary:A study of indium-incorporated copper selenide thin-film deposition on a glass substrate using the successive ionic adsorption and reaction method (SILAR) and the resulting properties is presented. The films were formed using these steps: selenization in the solution of diseleniumtetrathionate acid, treatment with copper(II/I) ions, incorporation of indium(III), and annealing in an inert nitrogen atmosphere. The elemental and phasal composition, as well as the morphological and optical properties of obtained films were determined. X-ray diffraction data showed a mixture of various compounds: Se, Cu<sub>0.87</sub>Se, In<sub>2</sub>Se<sub>3</sub>, and CuInSe<sub>2</sub>. The obtained films had a dendritic structure, agglomerated and not well-defined grains, and a film thickness of ~90 μm. The band gap values of copper selenide were 1.28–1.30 eV and increased after indium-incorporation and annealing. The optical properties of the formed films correspond to the optical properties of copper selenide and indium selenide semiconductors.
ISSN:1996-1944