The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints

The in-situ observation of Sn-3.0Ag-0.5Cu solder joints under electromigration was conducted to investigate the microstructure and grain orientation evolution. It was observed that there was a grain rotation phenomenon during current stressing by in-situ electron backscattered diffraction (EBSD). Th...

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Bibliographic Details
Main Authors: Xing Fu, Min Liu, KeXin Xu, Si Chen, YiJun Shi, ZhiWei Fu, Yun Huang, HongTao Chen, RuoHe Yao
Format: Article
Language:English
Published: MDPI AG 2020-12-01
Series:Materials
Subjects:
electromigration
in-situ EBSD
grain rotation
Sn hillock
grain boundary
Online Access:https://www.mdpi.com/1996-1944/13/23/5497

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