Collective laser‐assisted bonding process for 3D TSV integration with NCP

Collective laser‐assisted bonding process for 3D TSV integration with NCP

Laser‐assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single‐tier LAB process for 3D through‐silicon via (TSV) integration with nonconductive paste (NCP), where each...

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Bibliographic Details
Main Authors: Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang, Seok Hwan Moon, Hyun‐Cheol Bae, Kwang‐Seong Choi
Format: Article
Language:English
Published: Electronics and Telecommunications Research Institute (ETRI) 2019-04-01
Series:ETRI Journal
Subjects:
3D integration
collective bonding
laser‐assisted bonding
NCP
TSV
Online Access:https://doi.org/10.4218/etrij.2018-0171

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