Improvement in surface conditions of electroplated Fe-Pt thick-film magnets

Improvement in surface conditions of electroplated Fe-Pt thick-film magnets

Fe-Pt thick-films were electroplated on Ta, Ti, Co, Ni, and Cu plates (substrates) using a direct current, and the surface morphology, the magnetic properties, and the crystal structure of the films were evaluated. The films plated on the Co, Ni, and Cu substrates showed much smooth surface compared...

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Main Authors: T. Yanai, J. Honda, R. Hamamura, Y. Omagari, H. Yamada, N. Fujita, K. Takashima, M. Nakano, H. Fukunaga
Format: Article
Language:English
Published: AIP Publishing LLC 2018-05-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.5007196
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spelling doaj-4cb11402608c4aaeaa57fbe87657bf372020-11-24T21:07:47ZengAIP Publishing LLCAIP Advances2158-32262018-05-0185056437056437-510.1063/1.5007196259892ADVImprovement in surface conditions of electroplated Fe-Pt thick-film magnetsT. Yanai0J. Honda1R. Hamamura2Y. Omagari3H. Yamada4N. Fujita5K. Takashima6M. Nakano7H. Fukunaga8Nagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanNagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanNagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanNagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanNational Institute of Technology, Nara College, 22 Yata-cho, Yamatokoriyama, Nara 639-1080, JapanNational Institute of Technology, Nara College, 22 Yata-cho, Yamatokoriyama, Nara 639-1080, JapanNagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanNagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanNagasaki University, 1-14 Bunkyo-Machi, Nagasaki 852-8521, JapanFe-Pt thick-films were electroplated on Ta, Ti, Co, Ni, and Cu plates (substrates) using a direct current, and the surface morphology, the magnetic properties, and the crystal structure of the films were evaluated. The films plated on the Co, Ni, and Cu substrates showed much smooth surface compared with those for the Ta and Ti ones, and we confirmed that the Cu plate was the most attractive substrate due to very small cracks after an annealing for L10 ordering. High coercivity (>800 kA/m) for the Cu substrate is almost the same as that for our previous study in which we employed the Ta substrate, and we found that the Cu plate is a hopeful substrate to improve the surface conditions of electroplated Fe-Pt thick-film magnets.http://dx.doi.org/10.1063/1.5007196
collection DOAJ
language English
format Article
sources DOAJ
author T. Yanai
J. Honda
R. Hamamura
Y. Omagari
H. Yamada
N. Fujita
K. Takashima
M. Nakano
H. Fukunaga
spellingShingle T. Yanai
J. Honda
R. Hamamura
Y. Omagari
H. Yamada
N. Fujita
K. Takashima
M. Nakano
H. Fukunaga
Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
AIP Advances
author_facet T. Yanai
J. Honda
R. Hamamura
Y. Omagari
H. Yamada
N. Fujita
K. Takashima
M. Nakano
H. Fukunaga
author_sort T. Yanai
title Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
title_short Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
title_full Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
title_fullStr Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
title_full_unstemmed Improvement in surface conditions of electroplated Fe-Pt thick-film magnets
title_sort improvement in surface conditions of electroplated fe-pt thick-film magnets
publisher AIP Publishing LLC
series AIP Advances
issn 2158-3226
publishDate 2018-05-01
description Fe-Pt thick-films were electroplated on Ta, Ti, Co, Ni, and Cu plates (substrates) using a direct current, and the surface morphology, the magnetic properties, and the crystal structure of the films were evaluated. The films plated on the Co, Ni, and Cu substrates showed much smooth surface compared with those for the Ta and Ti ones, and we confirmed that the Cu plate was the most attractive substrate due to very small cracks after an annealing for L10 ordering. High coercivity (>800 kA/m) for the Cu substrate is almost the same as that for our previous study in which we employed the Ta substrate, and we found that the Cu plate is a hopeful substrate to improve the surface conditions of electroplated Fe-Pt thick-film magnets.
url http://dx.doi.org/10.1063/1.5007196
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