Synthesis of silver/copper nanoparticles and their metalmetal bonding property

The present paper describes a metal-metal bonding technique using Cu nanoparticles containing Ag nanoparticles (Ag/Cu nanoparticles). The Ag/Cu nanoparticles with particle sizes of 30-85 nm and crystal sizes of 9.3 nm for Cu and 8.1 nm for Ag were produced by reducing 5.0x10-3 M Ag+ (AgClO4) and...

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Bibliographic Details
Main Authors: Kobayashi Y., Shirochi T., Yasuda Y., Morita T.
Format: Article
Language:English
Published: Technical Faculty, Bor 2013-01-01
Series:Journal of Mining and Metallurgy. Section B: Metallurgy
Subjects:
Online Access:http://www.doiserbia.nb.rs/img/doi/1450-5339/2013/1450-53391300025K.pdf

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