High-performance flexible metal-on-silicon thermocouple
Abstract We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally meas...
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doaj-59acb722d00946438107eb419e997b0a2020-12-08T05:28:01ZengNature Publishing GroupScientific Reports2045-23222018-09-018111010.1038/s41598-018-32169-9High-performance flexible metal-on-silicon thermocoupleDaniel Assumpcao0Shailabh Kumar1Vinayak Narasimhan2Jongho Lee3Hyuck Choo4Department of Electrical Engineering, California Institute of TechnologyDepartment of Medical Engineering, California Institute of TechnologyDepartment of Medical Engineering, California Institute of TechnologySchool of Mechanical Engineering, Gwangju Institute of Science and TechnologyDepartment of Electrical Engineering, California Institute of TechnologyAbstract We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally measured Seebeck coefficient of our thermocouple was 9.17 × 10−4 V/°K, which is 30 times larger than those reported for standard metal thin-film thermocouples and comparable to the values of alloy-based thin-film thermocouples that require sophisticated and costly fabrication processes. The temperature-voltage measurements between 20 to 80 °C were highly linear with a linearity coefficient of 1, and the experimentally demonstrated temperature-sensing resolution was 0.01 °K which could be further improved up to a theoretical limit of 0.00055 °K. Finally, we applied this approach to demonstrate a flexible metal-on-silicon thermocouple with enhanced thermal sensitivity. The outstanding performance of our thermocouple combined with an extremely thin profile, bending flexibility, and simple, highly-compatible fabrication will proliferate its use in diverse applications such as micro-/nanoscale biometrics, energy management, and nanoscale thermography.https://doi.org/10.1038/s41598-018-32169-9Thin Film ThermocouplesSeebeck CoefficientTemporal Resolution SensorsCostly Fabrication ProcessesSilicone Arm |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Daniel Assumpcao Shailabh Kumar Vinayak Narasimhan Jongho Lee Hyuck Choo |
spellingShingle |
Daniel Assumpcao Shailabh Kumar Vinayak Narasimhan Jongho Lee Hyuck Choo High-performance flexible metal-on-silicon thermocouple Scientific Reports Thin Film Thermocouples Seebeck Coefficient Temporal Resolution Sensors Costly Fabrication Processes Silicone Arm |
author_facet |
Daniel Assumpcao Shailabh Kumar Vinayak Narasimhan Jongho Lee Hyuck Choo |
author_sort |
Daniel Assumpcao |
title |
High-performance flexible metal-on-silicon thermocouple |
title_short |
High-performance flexible metal-on-silicon thermocouple |
title_full |
High-performance flexible metal-on-silicon thermocouple |
title_fullStr |
High-performance flexible metal-on-silicon thermocouple |
title_full_unstemmed |
High-performance flexible metal-on-silicon thermocouple |
title_sort |
high-performance flexible metal-on-silicon thermocouple |
publisher |
Nature Publishing Group |
series |
Scientific Reports |
issn |
2045-2322 |
publishDate |
2018-09-01 |
description |
Abstract We have demonstrated metal-on-silicon thermocouples with a noticeably high Seebeck coefficient and an excellent temperature-sensing resolution. Fabrication of the thermocouples involved only simple photolithography and metal-liftoff procedures on a silicon substrate. The experimentally measured Seebeck coefficient of our thermocouple was 9.17 × 10−4 V/°K, which is 30 times larger than those reported for standard metal thin-film thermocouples and comparable to the values of alloy-based thin-film thermocouples that require sophisticated and costly fabrication processes. The temperature-voltage measurements between 20 to 80 °C were highly linear with a linearity coefficient of 1, and the experimentally demonstrated temperature-sensing resolution was 0.01 °K which could be further improved up to a theoretical limit of 0.00055 °K. Finally, we applied this approach to demonstrate a flexible metal-on-silicon thermocouple with enhanced thermal sensitivity. The outstanding performance of our thermocouple combined with an extremely thin profile, bending flexibility, and simple, highly-compatible fabrication will proliferate its use in diverse applications such as micro-/nanoscale biometrics, energy management, and nanoscale thermography. |
topic |
Thin Film Thermocouples Seebeck Coefficient Temporal Resolution Sensors Costly Fabrication Processes Silicone Arm |
url |
https://doi.org/10.1038/s41598-018-32169-9 |
work_keys_str_mv |
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