New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties

Figures-of-Merit (FOMs) are widely-used to compare power semiconductor materials and devices and to motivate research and development of new technology nodes. These material- and device-specific FOMs, however, fail to directly translate into quantifiable performance in a specific power electronics a...

Full description

Bibliographic Details
Main Authors: Jon Azurza Anderson, Grayson Zulauf, Johann W. Kolar, Gerald Deboy
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Open Journal of Power Electronics
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9172101/
id doaj-5b25ee977e8b43c6afe03f7df41e7f2c
record_format Article
spelling doaj-5b25ee977e8b43c6afe03f7df41e7f2c2021-03-29T18:59:19ZengIEEEIEEE Open Journal of Power Electronics2644-13142020-01-01132233810.1109/OJPEL.2020.30182209172101New Figure-of-Merit Combining Semiconductor and Multi-Level Converter PropertiesJon Azurza Anderson0https://orcid.org/0000-0002-2222-5185Grayson Zulauf1https://orcid.org/0000-0001-7180-002XJohann W. Kolar2https://orcid.org/0000-0002-6000-7402Gerald Deboy3Power Electronic Systems Laboratory (PES), ETH Zurich, SwitzerlandPower Electronic Systems Laboratory (PES), ETH Zurich, SwitzerlandPower Electronic Systems Laboratory (PES), ETH Zurich, SwitzerlandInfineon Technologies Austria AG, Villach, AustriaFigures-of-Merit (FOMs) are widely-used to compare power semiconductor materials and devices and to motivate research and development of new technology nodes. These material- and device-specific FOMs, however, fail to directly translate into quantifiable performance in a specific power electronics application. Here, we combine device performance with specific bridge-leg topologies to propose the extended FOM, or X-FOM, a Figure-of-Merit that quantifies bridge-leg performance in multi-level (ML) topologies and supports the quantitative comparison and optimization of topologies and power devices. To arrive at the proposed X-FOM, we revisit the fundamental scaling laws of the on-state resistance and output capacitance of power semiconductors to first propose a revised device-level semiconductor Figure-of-Merit (D-FOM). The D-FOM is then generalized to a multi-level topology with an arbitrary number of levels, output power, and input voltage, resulting in the X-FOM that quantitatively compares hard-switched semiconductor stage losses and filter stage requirements across different bridge-leg structures and numbers of levels, identifies the maximum achievable efficiency of the semiconductor stage, and determines the loss-optimal combination of semiconductor die area and switching frequency. To validate the new X-FOM and showcase its utility, we perform a case study on candidate bridge-leg structures for a three-phase 10 kW photovoltaic (PV) inverter, with the X-FOM showing that (a) the minimum hard-switching losses are an accurate approximation to predict the theoretically maximum achievable efficiency and relative performance between bridge-legs and (b) the 3-level bridge-leg outperforms the 2-level configuration, despite utilizing a SiC MOSFET with a lower D-FOM than in the 2-level case.https://ieeexplore.ieee.org/document/9172101/AC-DC power convertersDC-AC power convertersmultilevel converterspower semiconductor devicessemiconductor device modelingswitched capacitor circuits
collection DOAJ
language English
format Article
sources DOAJ
author Jon Azurza Anderson
Grayson Zulauf
Johann W. Kolar
Gerald Deboy
spellingShingle Jon Azurza Anderson
Grayson Zulauf
Johann W. Kolar
Gerald Deboy
New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
IEEE Open Journal of Power Electronics
AC-DC power converters
DC-AC power converters
multilevel converters
power semiconductor devices
semiconductor device modeling
switched capacitor circuits
author_facet Jon Azurza Anderson
Grayson Zulauf
Johann W. Kolar
Gerald Deboy
author_sort Jon Azurza Anderson
title New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
title_short New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
title_full New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
title_fullStr New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
title_full_unstemmed New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
title_sort new figure-of-merit combining semiconductor and multi-level converter properties
publisher IEEE
series IEEE Open Journal of Power Electronics
issn 2644-1314
publishDate 2020-01-01
description Figures-of-Merit (FOMs) are widely-used to compare power semiconductor materials and devices and to motivate research and development of new technology nodes. These material- and device-specific FOMs, however, fail to directly translate into quantifiable performance in a specific power electronics application. Here, we combine device performance with specific bridge-leg topologies to propose the extended FOM, or X-FOM, a Figure-of-Merit that quantifies bridge-leg performance in multi-level (ML) topologies and supports the quantitative comparison and optimization of topologies and power devices. To arrive at the proposed X-FOM, we revisit the fundamental scaling laws of the on-state resistance and output capacitance of power semiconductors to first propose a revised device-level semiconductor Figure-of-Merit (D-FOM). The D-FOM is then generalized to a multi-level topology with an arbitrary number of levels, output power, and input voltage, resulting in the X-FOM that quantitatively compares hard-switched semiconductor stage losses and filter stage requirements across different bridge-leg structures and numbers of levels, identifies the maximum achievable efficiency of the semiconductor stage, and determines the loss-optimal combination of semiconductor die area and switching frequency. To validate the new X-FOM and showcase its utility, we perform a case study on candidate bridge-leg structures for a three-phase 10 kW photovoltaic (PV) inverter, with the X-FOM showing that (a) the minimum hard-switching losses are an accurate approximation to predict the theoretically maximum achievable efficiency and relative performance between bridge-legs and (b) the 3-level bridge-leg outperforms the 2-level configuration, despite utilizing a SiC MOSFET with a lower D-FOM than in the 2-level case.
topic AC-DC power converters
DC-AC power converters
multilevel converters
power semiconductor devices
semiconductor device modeling
switched capacitor circuits
url https://ieeexplore.ieee.org/document/9172101/
work_keys_str_mv AT jonazurzaanderson newfigureofmeritcombiningsemiconductorandmultilevelconverterproperties
AT graysonzulauf newfigureofmeritcombiningsemiconductorandmultilevelconverterproperties
AT johannwkolar newfigureofmeritcombiningsemiconductorandmultilevelconverterproperties
AT geralddeboy newfigureofmeritcombiningsemiconductorandmultilevelconverterproperties
_version_ 1724196137875800064