New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties
Figures-of-Merit (FOMs) are widely-used to compare power semiconductor materials and devices and to motivate research and development of new technology nodes. These material- and device-specific FOMs, however, fail to directly translate into quantifiable performance in a specific power electronics a...
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doaj-5b25ee977e8b43c6afe03f7df41e7f2c2021-03-29T18:59:19ZengIEEEIEEE Open Journal of Power Electronics2644-13142020-01-01132233810.1109/OJPEL.2020.30182209172101New Figure-of-Merit Combining Semiconductor and Multi-Level Converter PropertiesJon Azurza Anderson0https://orcid.org/0000-0002-2222-5185Grayson Zulauf1https://orcid.org/0000-0001-7180-002XJohann W. Kolar2https://orcid.org/0000-0002-6000-7402Gerald Deboy3Power Electronic Systems Laboratory (PES), ETH Zurich, SwitzerlandPower Electronic Systems Laboratory (PES), ETH Zurich, SwitzerlandPower Electronic Systems Laboratory (PES), ETH Zurich, SwitzerlandInfineon Technologies Austria AG, Villach, AustriaFigures-of-Merit (FOMs) are widely-used to compare power semiconductor materials and devices and to motivate research and development of new technology nodes. These material- and device-specific FOMs, however, fail to directly translate into quantifiable performance in a specific power electronics application. Here, we combine device performance with specific bridge-leg topologies to propose the extended FOM, or X-FOM, a Figure-of-Merit that quantifies bridge-leg performance in multi-level (ML) topologies and supports the quantitative comparison and optimization of topologies and power devices. To arrive at the proposed X-FOM, we revisit the fundamental scaling laws of the on-state resistance and output capacitance of power semiconductors to first propose a revised device-level semiconductor Figure-of-Merit (D-FOM). The D-FOM is then generalized to a multi-level topology with an arbitrary number of levels, output power, and input voltage, resulting in the X-FOM that quantitatively compares hard-switched semiconductor stage losses and filter stage requirements across different bridge-leg structures and numbers of levels, identifies the maximum achievable efficiency of the semiconductor stage, and determines the loss-optimal combination of semiconductor die area and switching frequency. To validate the new X-FOM and showcase its utility, we perform a case study on candidate bridge-leg structures for a three-phase 10 kW photovoltaic (PV) inverter, with the X-FOM showing that (a) the minimum hard-switching losses are an accurate approximation to predict the theoretically maximum achievable efficiency and relative performance between bridge-legs and (b) the 3-level bridge-leg outperforms the 2-level configuration, despite utilizing a SiC MOSFET with a lower D-FOM than in the 2-level case.https://ieeexplore.ieee.org/document/9172101/AC-DC power convertersDC-AC power convertersmultilevel converterspower semiconductor devicessemiconductor device modelingswitched capacitor circuits |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Jon Azurza Anderson Grayson Zulauf Johann W. Kolar Gerald Deboy |
spellingShingle |
Jon Azurza Anderson Grayson Zulauf Johann W. Kolar Gerald Deboy New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties IEEE Open Journal of Power Electronics AC-DC power converters DC-AC power converters multilevel converters power semiconductor devices semiconductor device modeling switched capacitor circuits |
author_facet |
Jon Azurza Anderson Grayson Zulauf Johann W. Kolar Gerald Deboy |
author_sort |
Jon Azurza Anderson |
title |
New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties |
title_short |
New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties |
title_full |
New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties |
title_fullStr |
New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties |
title_full_unstemmed |
New Figure-of-Merit Combining Semiconductor and Multi-Level Converter Properties |
title_sort |
new figure-of-merit combining semiconductor and multi-level converter properties |
publisher |
IEEE |
series |
IEEE Open Journal of Power Electronics |
issn |
2644-1314 |
publishDate |
2020-01-01 |
description |
Figures-of-Merit (FOMs) are widely-used to compare power semiconductor materials and devices and to motivate research and development of new technology nodes. These material- and device-specific FOMs, however, fail to directly translate into quantifiable performance in a specific power electronics application. Here, we combine device performance with specific bridge-leg topologies to propose the extended FOM, or X-FOM, a Figure-of-Merit that quantifies bridge-leg performance in multi-level (ML) topologies and supports the quantitative comparison and optimization of topologies and power devices. To arrive at the proposed X-FOM, we revisit the fundamental scaling laws of the on-state resistance and output capacitance of power semiconductors to first propose a revised device-level semiconductor Figure-of-Merit (D-FOM). The D-FOM is then generalized to a multi-level topology with an arbitrary number of levels, output power, and input voltage, resulting in the X-FOM that quantitatively compares hard-switched semiconductor stage losses and filter stage requirements across different bridge-leg structures and numbers of levels, identifies the maximum achievable efficiency of the semiconductor stage, and determines the loss-optimal combination of semiconductor die area and switching frequency. To validate the new X-FOM and showcase its utility, we perform a case study on candidate bridge-leg structures for a three-phase 10 kW photovoltaic (PV) inverter, with the X-FOM showing that (a) the minimum hard-switching losses are an accurate approximation to predict the theoretically maximum achievable efficiency and relative performance between bridge-legs and (b) the 3-level bridge-leg outperforms the 2-level configuration, despite utilizing a SiC MOSFET with a lower D-FOM than in the 2-level case. |
topic |
AC-DC power converters DC-AC power converters multilevel converters power semiconductor devices semiconductor device modeling switched capacitor circuits |
url |
https://ieeexplore.ieee.org/document/9172101/ |
work_keys_str_mv |
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