Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper
Photovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells (SPMSCs) were presented with electroplated copper (EPC) as the rear contact. The boron back surface field (B-BSF) formed by spin-on doping and laser doping (LD) was prepared as a seed layer for the EPC. T...
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Series: | International Journal of Photoenergy |
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doaj-5c5d963b306648758e9ff4e82cb6ad882020-11-24T23:46:42ZengHindawi LimitedInternational Journal of Photoenergy1110-662X1687-529X2019-01-01201910.1155/2019/53729045372904Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated CopperChin-Lung Cheng0Chi-Chung Liu1Chun-Tin Yeh2Department of Electro-Optical Engineering, National Formosa University, Yunlin 63201, TaiwanDepartment of Electro-Optical Engineering, National Formosa University, Yunlin 63201, TaiwanDepartment of Electro-Optical Engineering, National Formosa University, Yunlin 63201, TaiwanPhotovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells (SPMSCs) were presented with electroplated copper (EPC) as the rear contact. The boron back surface field (B-BSF) formed by spin-on doping and laser doping (LD) was prepared as a seed layer for the EPC. The LD parameters, including the laser focus, laser power, laser speed, and laser line pitch, were investigated. Moreover, the effects of KOH etching on the surface properties after the LD process were explored. Furthermore, to enhance the adhesion between the B-BSF seed layer and EPC contact layer, a laser pinhole process was proposed. Finally, the EPC processes with various electroplating times were addressed. The results revealed that the mechanism of enhancements could be attributed to a continuous B-BSF seed layer and a reduction of series resistance, as well as an increase of open-circuit voltage and adhesion between the B-BSF seed layer and EPC contact layer.http://dx.doi.org/10.1155/2019/5372904 |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Chin-Lung Cheng Chi-Chung Liu Chun-Tin Yeh |
spellingShingle |
Chin-Lung Cheng Chi-Chung Liu Chun-Tin Yeh Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper International Journal of Photoenergy |
author_facet |
Chin-Lung Cheng Chi-Chung Liu Chun-Tin Yeh |
author_sort |
Chin-Lung Cheng |
title |
Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper |
title_short |
Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper |
title_full |
Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper |
title_fullStr |
Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper |
title_full_unstemmed |
Photovoltaic and Physical Characteristics of Screen-Printed Monocrystalline Silicon Solar Cells with Laser Doping and Electroplated Copper |
title_sort |
photovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells with laser doping and electroplated copper |
publisher |
Hindawi Limited |
series |
International Journal of Photoenergy |
issn |
1110-662X 1687-529X |
publishDate |
2019-01-01 |
description |
Photovoltaic and physical characteristics of screen-printed monocrystalline silicon solar cells (SPMSCs) were presented with electroplated copper (EPC) as the rear contact. The boron back surface field (B-BSF) formed by spin-on doping and laser doping (LD) was prepared as a seed layer for the EPC. The LD parameters, including the laser focus, laser power, laser speed, and laser line pitch, were investigated. Moreover, the effects of KOH etching on the surface properties after the LD process were explored. Furthermore, to enhance the adhesion between the B-BSF seed layer and EPC contact layer, a laser pinhole process was proposed. Finally, the EPC processes with various electroplating times were addressed. The results revealed that the mechanism of enhancements could be attributed to a continuous B-BSF seed layer and a reduction of series resistance, as well as an increase of open-circuit voltage and adhesion between the B-BSF seed layer and EPC contact layer. |
url |
http://dx.doi.org/10.1155/2019/5372904 |
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