Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications
Recently, nanosilver pastes have emerged as one of the most promising high temperature bonding materials for high frequency and high power applications, which provide an effective lead-free electronic packaging solution instead of high-lead and gold-based solders. Although nanosilver pastes can be s...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-07-01
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| Series: | Micromachines |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2072-666X/9/7/346 |