Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs
In this paper, a multi-step packaging (MSP) concept for series-connected SiC-MOSFETs is analyzed. The parasitic capacitance generated by the dielectric isolation of each device in the stack has a significant impact on the dynamic behavior of SiC devices, which impacts the voltage-sharing performance...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-08-01
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| Series: | Electronics |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9292/9/9/1341 |