Electrical Design and Evaluation of Asynchronous Serial Bus Communication Network of 48 Sensor Platform LSIs with Single-Ended I/O for Integrated MEMS-LSI Sensors

• Main Authors: Chenzhong Shao, Shuji Tanaka, Takahiro Nakayama, Yoshiyuki Hata, Masanori Muroyama
• Format: Article
• Language: English
• Published: MDPI AG 2018-01-01
• Series: Sensors
• Subjects: robot tactile sense; dedicated CMOS-LSI; LSI network system; data collision avoidance; backbone bus topology; single-ended signaling
• Online Access: http://www.mdpi.com/1424-8220/18/1/231

For installing many sensors in a limited space with a limited computing resource, the digitization of the sensor output at the site of sensation has advantages such as a small amount of wiring, low signal interference and high scalability. For this purpose, we have developed a dedicated Complementary Metal-Oxide-Semiconductor (CMOS) Large-Scale Integration (LSI) (referred to as “sensor platform LSI”) for bus-networked Micro-Electro-Mechanical-Systems (MEMS)-LSI integrated sensors. In this LSI, collision avoidance, adaptation and event-driven functions are simply implemented to relieve data collision and congestion in asynchronous serial bus communication. In this study, we developed a network system with 48 sensor platform LSIs based on Printed Circuit Board (PCB) in a backbone bus topology with the bus length being 2.4 m. We evaluated the serial communication performance when 48 LSIs operated simultaneously with the adaptation function. The number of data packets received from each LSI was almost identical, and the average sampling frequency of 384 capacitance channels (eight for each LSI) was 73.66 Hz.