Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing...

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Bibliographic Details
Main Authors: Stringer Jonathan, Althagathi Talal M., Tse Christopher C.W., Ta Van Duong, Shephard Jonathan D., Esenturk Emre, Connaughton Colm, Wasley Thomas J., Li Ji, Kay Robert W., Smith Patrick J.
Format: Article
Language:English
Published: EDP Sciences 2016-01-01
Series:Manufacturing Review
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Online Access:http://dx.doi.org/10.1051/mfreview/2016011
Description
Summary:Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed.
ISSN:2265-4224