Acetic acid mediated leaching of metals from lead-free solders
Abstract Background The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment. However, the Pb-free solders contain metals such as silver (Ag), copper (Cu), and zinc (Zn). The increasing us...
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doaj-6e286d3f889a43fcb1083edc6ec2787f2020-11-24T23:05:52ZengSpringerOpenBioresources and Bioprocessing2197-43652017-10-014111010.1186/s40643-017-0173-5Acetic acid mediated leaching of metals from lead-free soldersU. Jadhav0C. Su1M. Chakankar2H. Hocheng3Department of Microbiology, Savitribai Phule Pune UniversityDepartment of Power Mechanical Engineering, National Tsing Hua UniversityDepartment of Power Mechanical Engineering, National Tsing Hua UniversityDepartment of Power Mechanical Engineering, National Tsing Hua UniversityAbstract Background The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment. However, the Pb-free solders contain metals such as silver (Ag), copper (Cu), and zinc (Zn). The increasing use of these Pb-free solders again increases the risk of release of Ag, Cu, and Zn metals into the environment. The Pb-free solders can, therefore, be used as a secondary source for the metals which will not only help in environmental protection but also for the resource recovery. Results This study reports a process to leach metals from hazardous soldering materials by acetic acid. Acetic acid was found more effective for metal recovery from the tin–copper (Sn–Cu) solder than tin–copper–silver (Sn–Cu–Ag) solder. Various process parameters were optimized for recovery of metals from Sn–Cu solder. It required 30 h for 100% recovery of Cu and Sn, respectively. The metal recovery increased gradually with an increase in acid concentration approaching complete recovery at an acid concentration of 80%. Effect of shaking speed and temperature on the recovery of metals from Sn–Cu solder was studied. The metal recovery decreased with an increase in solder weight. Conclusion The present study reveals an effective process to recycle the Pb-free solders. The low concentration of acetic acid was also found significant for metal leaching from solder. The research provides basic knowledge for recovery of metals from Pb-free solders.http://link.springer.com/article/10.1186/s40643-017-0173-5Industrial wasteSoldersMetal recoveryAcetic acid |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
U. Jadhav C. Su M. Chakankar H. Hocheng |
spellingShingle |
U. Jadhav C. Su M. Chakankar H. Hocheng Acetic acid mediated leaching of metals from lead-free solders Bioresources and Bioprocessing Industrial waste Solders Metal recovery Acetic acid |
author_facet |
U. Jadhav C. Su M. Chakankar H. Hocheng |
author_sort |
U. Jadhav |
title |
Acetic acid mediated leaching of metals from lead-free solders |
title_short |
Acetic acid mediated leaching of metals from lead-free solders |
title_full |
Acetic acid mediated leaching of metals from lead-free solders |
title_fullStr |
Acetic acid mediated leaching of metals from lead-free solders |
title_full_unstemmed |
Acetic acid mediated leaching of metals from lead-free solders |
title_sort |
acetic acid mediated leaching of metals from lead-free solders |
publisher |
SpringerOpen |
series |
Bioresources and Bioprocessing |
issn |
2197-4365 |
publishDate |
2017-10-01 |
description |
Abstract Background The replacement of lead (Pb)-bearing solders by several Pb-free solders is a subject of intense research in these days due to the toxic effects of Pb on the environment. However, the Pb-free solders contain metals such as silver (Ag), copper (Cu), and zinc (Zn). The increasing use of these Pb-free solders again increases the risk of release of Ag, Cu, and Zn metals into the environment. The Pb-free solders can, therefore, be used as a secondary source for the metals which will not only help in environmental protection but also for the resource recovery. Results This study reports a process to leach metals from hazardous soldering materials by acetic acid. Acetic acid was found more effective for metal recovery from the tin–copper (Sn–Cu) solder than tin–copper–silver (Sn–Cu–Ag) solder. Various process parameters were optimized for recovery of metals from Sn–Cu solder. It required 30 h for 100% recovery of Cu and Sn, respectively. The metal recovery increased gradually with an increase in acid concentration approaching complete recovery at an acid concentration of 80%. Effect of shaking speed and temperature on the recovery of metals from Sn–Cu solder was studied. The metal recovery decreased with an increase in solder weight. Conclusion The present study reveals an effective process to recycle the Pb-free solders. The low concentration of acetic acid was also found significant for metal leaching from solder. The research provides basic knowledge for recovery of metals from Pb-free solders. |
topic |
Industrial waste Solders Metal recovery Acetic acid |
url |
http://link.springer.com/article/10.1186/s40643-017-0173-5 |
work_keys_str_mv |
AT ujadhav aceticacidmediatedleachingofmetalsfromleadfreesolders AT csu aceticacidmediatedleachingofmetalsfromleadfreesolders AT mchakankar aceticacidmediatedleachingofmetalsfromleadfreesolders AT hhocheng aceticacidmediatedleachingofmetalsfromleadfreesolders |
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