Transient Liquid Phase Bonding of Al-6063 to Steel Alloy UNS S32304

• Main Authors: Mohamed I. Saleh, Hans J. Roven, Tahir I. Khan, Terje Iveland
• Format: Article
• Language: English
• Published: MDPI AG 2018-09-01
• Series: Journal of Manufacturing and Materials Processing
• Subjects: TLP bonding; eutectic; aluminum alloys; duplex stainless steel
• Online Access: http://www.mdpi.com/2504-4494/2/3/58

Transient liquid phase (TLP) bonding of 6063 aluminum alloy (Al-6063) and duplex alloy 2304 stainless steel (UNS S32304) was performed using copper foil as an interlayer between the base metals. A compression load was applied normal to the specimens. Metallurgical examination of the produced joints showed three distinct regions including a reaction zone, diffusion affected zone, and the base metals. The diffusion of copper into aluminum resulted in an Al–Cu eutectic structure. However, the oxide layer on the aluminum surface controlled the dissolution behavior of copper and the extent of its wettability with the base metals. Although voids and intermetallic compounds were detected at the interfaces of the processed joints, a defect free joint was produced at 570 °C. In addition, the results from corrosion tests showed that the use of copper as an interlayer decreased the corrosion resistance of the joints. However, increase in thickness of the joining reaction zone with increasing bonding temperature was observed to increase corrosion resistance.