Removal Characteristics of Sapphire Lapping using Composite Plates with Consciously Patterned Resinoid-Bonded Semifixed Diamond Grits

Sapphire lapping is of key importance for the successful planarization of wafers that are widely present in electronic devices. However, the high hardness of sapphire makes it extremely challenging to improve its material removal rate during the lapping process without compromising surface quality a...

Full description

Bibliographic Details
Main Authors: Wenshan Wang, Yiqing Yu, Zhongwei Hu, Congfu Fang, Jing Lu, Xipeng Xu
Format: Article
Language:English
Published: MDPI AG 2020-04-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/10/4/293

Similar Items