A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties

Benzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore,...

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Main Authors: Qilin Mei, Honghua Wang, Danliao Tong, Jiuqiang Song, Zhixiong Huang
Format: Article
Language:English
Published: MDPI AG 2020-04-01
Series:Polymers
Subjects:
Online Access:https://www.mdpi.com/2073-4360/12/5/999
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spelling doaj-7b2b933ead5f42289394a74721c60b8c2020-11-25T02:13:22ZengMDPI AGPolymers2073-43602020-04-011299999910.3390/polym12050999A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal PropertiesQilin Mei0Honghua Wang1Danliao Tong2Jiuqiang Song3Zhixiong Huang4School of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaSchool of Materials Science and Engineering, Wuhan University of Technology, 122 Luoshi Road, Wuhan 430070, ChinaBenzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore, higher thermal stability is imperiously demanded in special areas. Incorporating both an acetylene group and silicon into the benzoxazine monomer is a promising possible solution to improve the curing processability, thermal properties and toughness of benzoxazine. In this paper, an acetylene-functional/silicon-containing benzoxazine monomer was prepared by two-step synthesis, and acetylene-functional benzoxazine was also prepared as a comparison. FTIR and <sup>1</sup>H NMR confirmed the molecular structure of acetylene-functional/silicon-containing benzoxazine. Differential scanning calorimetry (DSC) analysis showed that the initial and peak degradation temperatures of acetylene-functional/silicon-containing benzoxazine were decreased by 21 °C and 18 °C compared with acetylene-functional benzoxazine, respectively. The apparent activation energy of the curing reaction of acetylene-functional/silicon-containing benzoxazine was 83.1 kJ/mol, which was slightly lower than acetylene-functional benzoxazine (84.7 kJ/mol). TGA results showed that the acetylene-functional/silicon-containing benzoxazine had a higher thermal stability than acetylene-functional benzoxazine. The temperatures of 5% weight loss of acetylene-functional/silicon-containing benzoxazine were 380 °C in nitrogen and 485 °C in air, and the char yield at 1000 °C was 80% in nitrogen and 21% in air, respectively. The results of mechanical properties showed that the impact strength of acetylene-functional/silicon-containing benzoxazine was higher than acetylene-functional benzoxazine by 35.4%. The tensile and flexural strengths of acetylene-functional/silicon-containing benzoxazine were slightly higher than that of acetylene-functional benzoxazine.https://www.mdpi.com/2073-4360/12/5/999benzoxazineacetylenesiliconcuring kineticsthermal stability
collection DOAJ
language English
format Article
sources DOAJ
author Qilin Mei
Honghua Wang
Danliao Tong
Jiuqiang Song
Zhixiong Huang
spellingShingle Qilin Mei
Honghua Wang
Danliao Tong
Jiuqiang Song
Zhixiong Huang
A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
Polymers
benzoxazine
acetylene
silicon
curing kinetics
thermal stability
author_facet Qilin Mei
Honghua Wang
Danliao Tong
Jiuqiang Song
Zhixiong Huang
author_sort Qilin Mei
title A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
title_short A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
title_full A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
title_fullStr A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
title_full_unstemmed A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
title_sort novel acetylene-functional/silicon-containing benzoxazine resin: preparation, curing kinetics and thermal properties
publisher MDPI AG
series Polymers
issn 2073-4360
publishDate 2020-04-01
description Benzoxazine resin has been paid more attention in the fields of aviation, electronics, automobiles and new energy industries because of its excellent comprehensive performance. Further application is limited, however, by shortcomings such as high brittleness and high curing temperature. Furthermore, higher thermal stability is imperiously demanded in special areas. Incorporating both an acetylene group and silicon into the benzoxazine monomer is a promising possible solution to improve the curing processability, thermal properties and toughness of benzoxazine. In this paper, an acetylene-functional/silicon-containing benzoxazine monomer was prepared by two-step synthesis, and acetylene-functional benzoxazine was also prepared as a comparison. FTIR and <sup>1</sup>H NMR confirmed the molecular structure of acetylene-functional/silicon-containing benzoxazine. Differential scanning calorimetry (DSC) analysis showed that the initial and peak degradation temperatures of acetylene-functional/silicon-containing benzoxazine were decreased by 21 °C and 18 °C compared with acetylene-functional benzoxazine, respectively. The apparent activation energy of the curing reaction of acetylene-functional/silicon-containing benzoxazine was 83.1 kJ/mol, which was slightly lower than acetylene-functional benzoxazine (84.7 kJ/mol). TGA results showed that the acetylene-functional/silicon-containing benzoxazine had a higher thermal stability than acetylene-functional benzoxazine. The temperatures of 5% weight loss of acetylene-functional/silicon-containing benzoxazine were 380 °C in nitrogen and 485 °C in air, and the char yield at 1000 °C was 80% in nitrogen and 21% in air, respectively. The results of mechanical properties showed that the impact strength of acetylene-functional/silicon-containing benzoxazine was higher than acetylene-functional benzoxazine by 35.4%. The tensile and flexural strengths of acetylene-functional/silicon-containing benzoxazine were slightly higher than that of acetylene-functional benzoxazine.
topic benzoxazine
acetylene
silicon
curing kinetics
thermal stability
url https://www.mdpi.com/2073-4360/12/5/999
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