Wafer-Scale Fabrication and Assembly Method of Multichannel Microelectrode Arrays for ECoG Application

• Main Authors: Cong Wang, Yu-Chen Wei, Ho-Kun Sung, Alok Kumar, Zhong-Liang Zhou, Dan-Qing Zou, Cheng-Peng Jiang, Guo-Feng Yan, Jee-Hyun Choi, Rajendra Dhakal
• Format: Article
• Language: English
• Published: MDPI AG 2021-01-01
• Series: Electronics
• Subjects: microelectrode arrays; wafer-scale fabrication; multichannel; neuronal recordings
• Online Access: https://www.mdpi.com/2079-9292/10/3/316

High density electrocorticography (ECoG)-based microelectrode arrays (MEAs) are fabricated to timely record the neural activities to provide the fundamental understanding in neuroscience and biomedical engineering. This paper aims to introduce a device-based concept and wafer-scale fabrication process for MEAs. Flexible and biocompatible polyimide is applied on MEAs to bear all possible stress and strain. Detailed fabrication key techniques, including surface treatment, polyimide stability measurement, evaporation process, and curing conditions, have been discussed thoroughly. Moreover, the fabricated polyimide-based MEAs are surface-mounted on well-packaged printed circuit boards (PCBs) via a slot-type connector without any additional wire bonding to make the signal recording process easier. An absence seizure was recorded during the in vivo test, which shows the availability of signal recording based on the presented MEAs. The proposed MEAs could be remained at the skull, while the connector and PCBs can be disassembled apart. Therefore, the testing sample will get less suffering. To verify the robustness of the fabricated MEAs, the impedance properties were characterized using electrochemical impedance spectroscopy. The measured results indicate an average impedance of 12.3 ± 0.675 kΩ at 1 kHz. In total, 10 groups of MEAs were sample tested, and over 90% of the total 60 channels per 1-MEAs operated efficiently.