Investigation of Formation Behaviour of Al–Cu Intermetallic Compounds in Al–50vol%Cu Composites Prepared by Spark Plasma Sintering under High Pressure
Al–Cu matrix composites with excellent mechanical and thermal properties are among the most promising materials for realising high performance in thermal management systems. However, intermetallic compounds (ICs) formed at the Al/Cu interfaces prevent direct contact between the metals and severely d...
Main Authors: | Dasom Kim, Kyungju Kim, Hansang Kwon |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-01-01
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Series: | Materials |
Subjects: | |
Online Access: | https://www.mdpi.com/1996-1944/14/2/266 |
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