The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer...
Main Authors: | , , , , , , |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-02-01
|
Series: | Metals |
Subjects: | |
Online Access: | https://www.mdpi.com/2075-4701/11/3/380 |
id |
doaj-8b3a716472bf4f6ab1904847e74eaad1 |
---|---|
record_format |
Article |
spelling |
doaj-8b3a716472bf4f6ab1904847e74eaad12021-02-26T00:07:15ZengMDPI AGMetals2075-47012021-02-011138038010.3390/met11030380The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder JointMohd Izrul Izwan Ramli0Mohd Arif Anuar Mohd Salleh1Rita Mohd Said2Mohd Mustafa Al Bakri Abdullah3Dewi Suriyani Che Halin4Norainiza Saud5Marcin Nabiałek6Center of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, (UniMAP), Jalan Kangar-Arau 02600, Perlis, MalaysiaCenter of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, (UniMAP), Jalan Kangar-Arau 02600, Perlis, MalaysiaCenter of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, (UniMAP), Jalan Kangar-Arau 02600, Perlis, MalaysiaCenter of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, (UniMAP), Jalan Kangar-Arau 02600, Perlis, MalaysiaCenter of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, (UniMAP), Jalan Kangar-Arau 02600, Perlis, MalaysiaCenter of Excellence Geopolymer & Green Technology (CEGeoGTech), Universiti Malaysia Perlis, (UniMAP), Jalan Kangar-Arau 02600, Perlis, MalaysiaDepartment of Physics, Czestochowa University of Technology, al. Armii Krajowej 19, 42-200 Częstochowa, PolandThe microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu<sub>3</sub>Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu<sub>6</sub>Sn<sub>5</sub> phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.https://www.mdpi.com/2075-4701/11/3/380zincintermetallic compoundIMC thicknessannealing process |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Mohd Izrul Izwan Ramli Mohd Arif Anuar Mohd Salleh Rita Mohd Said Mohd Mustafa Al Bakri Abdullah Dewi Suriyani Che Halin Norainiza Saud Marcin Nabiałek |
spellingShingle |
Mohd Izrul Izwan Ramli Mohd Arif Anuar Mohd Salleh Rita Mohd Said Mohd Mustafa Al Bakri Abdullah Dewi Suriyani Che Halin Norainiza Saud Marcin Nabiałek The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint Metals zinc intermetallic compound IMC thickness annealing process |
author_facet |
Mohd Izrul Izwan Ramli Mohd Arif Anuar Mohd Salleh Rita Mohd Said Mohd Mustafa Al Bakri Abdullah Dewi Suriyani Che Halin Norainiza Saud Marcin Nabiałek |
author_sort |
Mohd Izrul Izwan Ramli |
title |
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint |
title_short |
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint |
title_full |
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint |
title_fullStr |
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint |
title_full_unstemmed |
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint |
title_sort |
effect of thermal annealing on the microstructure and mechanical properties of sn-0.7cu-xzn solder joint |
publisher |
MDPI AG |
series |
Metals |
issn |
2075-4701 |
publishDate |
2021-02-01 |
description |
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu<sub>3</sub>Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu<sub>6</sub>Sn<sub>5</sub> phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint. |
topic |
zinc intermetallic compound IMC thickness annealing process |
url |
https://www.mdpi.com/2075-4701/11/3/380 |
work_keys_str_mv |
AT mohdizrulizwanramli theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT mohdarifanuarmohdsalleh theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT ritamohdsaid theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT mohdmustafaalbakriabdullah theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT dewisuriyanichehalin theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT norainizasaud theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT marcinnabiałek theeffectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT mohdizrulizwanramli effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT mohdarifanuarmohdsalleh effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT ritamohdsaid effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT mohdmustafaalbakriabdullah effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT dewisuriyanichehalin effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT norainizasaud effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint AT marcinnabiałek effectofthermalannealingonthemicrostructureandmechanicalpropertiesofsn07cuxznsolderjoint |
_version_ |
1724250249385476096 |