Efficient 3D-TLM Modeling and Simulation for the Thermal Management of Microwave AlGaN/GaN HEMT Used in High Power Amplifiers SSPA

Efficient 3D-TLM Modeling and Simulation for the Thermal Management of Microwave AlGaN/GaN HEMT Used in High Power Amplifiers SSPA

A three-dimensional thermal simulation investigation for the thermal management of GaN-on-SiC monolithic microwave integrated circuits (MMICs) of consisting multi-fingers (HEMTs) is presented. The purpose of this work is to demonstrate the utility and efficiency of the three-dimensional Transmission...

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Bibliographic Details
Main Authors:	Karim Belkacemi, Rachida Hocine
Format:	Article
Language:	English
Published:	MDPI AG 2018-06-01
Series:	Journal of Low Power Electronics and Applications
Subjects:	AlGaN/GaN HEMTs SSPA heat transfer self-heating 3D TLM method Nano-scale hot spots Raman spectroscopy
Online Access:	http://www.mdpi.com/2079-9268/8/3/23

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