Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

Effects of CuZnAl Particles on Properties and Microstructure of Sn-58Bi Solder

With the purpose of improving the properties of the Sn-58Bi lead-free solder, micro-CuZnAl particles ranging from 0 to 0.4 wt % were added into the low temperature eutectic Sn-58Bi lead-free solder. After the experimental testing of micro-CuZnAl particles on the properties and microstructure of the...

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Bibliographic Details
Main Authors: Fan Yang, Liang Zhang, Zhi-quan Liu, Su Juan Zhong, Jia Ma, Li Bao
Format: Article
Language:English
Published: MDPI AG 2017-05-01
Series:Materials
Subjects:
Sn-58Bi solder
lead-free solder
microstructure
Online Access:http://www.mdpi.com/1996-1944/10/5/558

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