An improved sodium silicate binder modified by ultra-fine powder materials
This paper presents a new method of modifying sodium silicate binder with ultra-fine powders. The sodium silicate binder modified by ultra-fine powder A and the organic B can reduce the addition amount of the binder. The results indicate that the 24 h strength has increased by 39.9% at room temperat...
Main Authors: | , , |
---|---|
Format: | Article |
Language: | English |
Published: |
Foundry Journal Agency
2007-02-01
|
Series: | China Foundry |
Subjects: | |
Online Access: | http://www.foundryworld.com/uploadfile/2008111840198909.pdf |
id |
doaj-93d3e29d680448c2b62f7acb24fb52dd |
---|---|
record_format |
Article |
spelling |
doaj-93d3e29d680448c2b62f7acb24fb52dd2020-11-24T23:26:15ZengFoundry Journal AgencyChina Foundry1672-64212007-02-01412630An improved sodium silicate binder modified by ultra-fine powder materials WANG Ji-naFAN Zi-tianWANG Hua-fangThis paper presents a new method of modifying sodium silicate binder with ultra-fine powders. The sodium silicate binder modified by ultra-fine powder A and the organic B can reduce the addition amount of the binder. The results indicate that the 24 h strength has increased by 39.9% at room temperature and the residual strength has decreased by 30.7% at 800℃, compared to the conventional sodium silicate. An available material to improve the moisture resistance was also found by adding about 2% more inorganic C, and it can increase the moist strength by 20%. In the end, the microanalyses are given to explain the modifying machanism, i. e., the ultra-fine powder A can refine the sodium silicate binder to avoid holes in the binder bond, which can increase the 24 h strength at room temperture, and can lead to more cracks in the bond after the molding sand is heated to 800℃. This is because of the stress caused by the new eutectic complex of modified sodium silicate binder.http://www.foundryworld.com/uploadfile/2008111840198909.pdfsodium silicate binder modificationultra-fine powder materialsbonding strengthmoisture resistancecollapsibility |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
WANG Ji-na FAN Zi-tian WANG Hua-fang |
spellingShingle |
WANG Ji-na FAN Zi-tian WANG Hua-fang An improved sodium silicate binder modified by ultra-fine powder materials China Foundry sodium silicate binder modification ultra-fine powder materials bonding strength moisture resistance collapsibility |
author_facet |
WANG Ji-na FAN Zi-tian WANG Hua-fang |
author_sort |
WANG Ji-na |
title |
An improved sodium silicate binder modified by ultra-fine powder materials |
title_short |
An improved sodium silicate binder modified by ultra-fine powder materials |
title_full |
An improved sodium silicate binder modified by ultra-fine powder materials |
title_fullStr |
An improved sodium silicate binder modified by ultra-fine powder materials |
title_full_unstemmed |
An improved sodium silicate binder modified by ultra-fine powder materials |
title_sort |
improved sodium silicate binder modified by ultra-fine powder materials |
publisher |
Foundry Journal Agency |
series |
China Foundry |
issn |
1672-6421 |
publishDate |
2007-02-01 |
description |
This paper presents a new method of modifying sodium silicate binder with ultra-fine powders. The sodium silicate binder modified by ultra-fine powder A and the organic B can reduce the addition amount of the binder. The results indicate that the 24 h strength has increased by 39.9% at room temperature and the residual strength has decreased by 30.7% at 800℃, compared to the conventional sodium silicate. An available material to improve the moisture resistance was also found by adding about 2% more inorganic C, and it can increase the moist strength by 20%. In the end, the microanalyses are given to explain the modifying machanism, i. e., the ultra-fine powder A can refine the sodium silicate binder to avoid holes in the binder bond, which can increase the 24 h strength at room temperture, and can lead to more cracks in the bond after the molding sand is heated to 800℃. This is because of the stress caused by the new eutectic complex of modified sodium silicate binder. |
topic |
sodium silicate binder modification ultra-fine powder materials bonding strength moisture resistance collapsibility |
url |
http://www.foundryworld.com/uploadfile/2008111840198909.pdf |
work_keys_str_mv |
AT wangjina animprovedsodiumsilicatebindermodifiedbyultrafinepowdermaterials AT fanzitian animprovedsodiumsilicatebindermodifiedbyultrafinepowdermaterials AT wanghuafang animprovedsodiumsilicatebindermodifiedbyultrafinepowdermaterials AT wangjina improvedsodiumsilicatebindermodifiedbyultrafinepowdermaterials AT fanzitian improvedsodiumsilicatebindermodifiedbyultrafinepowdermaterials AT wanghuafang improvedsodiumsilicatebindermodifiedbyultrafinepowdermaterials |
_version_ |
1725555765165424640 |