TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages

• Main Authors: Lorenzo Codecasa, Salvatore Race, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa
• Format: Article
• Language: English
• Published: MDPI AG 2019-03-01
• Series: Energies
• Subjects: electronic packages; JEDEC metrics; model-order reduction; thermal simulation
• Online Access: http://www.mdpi.com/1996-1073/12/6/1050

This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages.