TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages
This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can va...
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2019-03-01
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Series: | Energies |
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Online Access: | http://www.mdpi.com/1996-1073/12/6/1050 |
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doaj-94d44d407b834c73983824d281abdd7e2020-11-25T02:16:43ZengMDPI AGEnergies1996-10732019-03-01126105010.3390/en12061050en12061050TRAC: A Thermal Resistance Advanced Calculator for Electronic PackagesLorenzo Codecasa0Salvatore Race1Vincenzo d’Alessandro2Donata Gualandris3Arianna Morelli4Claudio Maria Villa5Department of Electronics, Information and Bioengineering, Politecnico di Milano, 20133 Milan, ItalyDepartment of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, ItalyDepartment of Electrical Engineering and Information Technology, University Federico II, 80125 Naples, ItalySTMicroelectronics, 20864 Agrate Brianza, ItalySTMicroelectronics, 20864 Agrate Brianza, ItalySTMicroelectronics, 20864 Agrate Brianza, ItalyThis paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages.http://www.mdpi.com/1996-1073/12/6/1050electronic packagesJEDEC metricsmodel-order reductionthermal simulation |
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DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Lorenzo Codecasa Salvatore Race Vincenzo d’Alessandro Donata Gualandris Arianna Morelli Claudio Maria Villa |
spellingShingle |
Lorenzo Codecasa Salvatore Race Vincenzo d’Alessandro Donata Gualandris Arianna Morelli Claudio Maria Villa TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages Energies electronic packages JEDEC metrics model-order reduction thermal simulation |
author_facet |
Lorenzo Codecasa Salvatore Race Vincenzo d’Alessandro Donata Gualandris Arianna Morelli Claudio Maria Villa |
author_sort |
Lorenzo Codecasa |
title |
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages |
title_short |
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages |
title_full |
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages |
title_fullStr |
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages |
title_full_unstemmed |
TRAC: A Thermal Resistance Advanced Calculator for Electronic Packages |
title_sort |
trac: a thermal resistance advanced calculator for electronic packages |
publisher |
MDPI AG |
series |
Energies |
issn |
1996-1073 |
publishDate |
2019-03-01 |
description |
This paper presents a novel simulation tool named thermal resistance advanced calculator (TRAC). Such a tool allows the straightforward definition of a parametric detailed thermal model of electronic packages with Manhattan geometry, in which the key geometrical details and thermal properties can vary in a chosen set. Additionally, it can apply a novel model-order reduction-based approach for the automatic and fast extraction of a parametric compact thermal model of such packages. Furthermore, it is suited to automatically determine the joint electron device engineering council (JEDEC) thermal metrics for any choice of parameters in a negligible amount of time. The tool was validated through the analysis of two families of quad flat packages. |
topic |
electronic packages JEDEC metrics model-order reduction thermal simulation |
url |
http://www.mdpi.com/1996-1073/12/6/1050 |
work_keys_str_mv |
AT lorenzocodecasa tracathermalresistanceadvancedcalculatorforelectronicpackages AT salvatorerace tracathermalresistanceadvancedcalculatorforelectronicpackages AT vincenzodalessandro tracathermalresistanceadvancedcalculatorforelectronicpackages AT donatagualandris tracathermalresistanceadvancedcalculatorforelectronicpackages AT ariannamorelli tracathermalresistanceadvancedcalculatorforelectronicpackages AT claudiomariavilla tracathermalresistanceadvancedcalculatorforelectronicpackages |
_version_ |
1724889526299525120 |