Synthesis of Tin Nitride Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>Nanowires by Chemical Vapour Deposition
<p>Abstract</p> <p>Tin nitride (Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>) nanowires have been grown for the first time by chemical vapour deposition on n-type Si(111) and in particular by nitridation of Sn containing NH<su...
Main Authors: | , |
---|---|
Format: | Article |
Language: | English |
Published: |
SpringerOpen
2009-01-01
|
Series: | Nanoscale Research Letters |
Subjects: | |
Online Access: | http://dx.doi.org/10.1007/s11671-009-9364-0 |
Summary: | <p>Abstract</p> <p>Tin nitride (Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>) nanowires have been grown for the first time by chemical vapour deposition on n-type Si(111) and in particular by nitridation of Sn containing NH<sub>4</sub>Cl at 450 °C under a steady flow of NH<sub>3</sub>. The Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>nanowires have an average diameter of 200 nm and lengths ≥5 μm and were grown on Si(111) coated with a few nm’s of Au. Nitridation of Sn alone, under a flow of NH<sub>3</sub>is not effective and leads to the deposition of Sn droplets on the Au/Si(111) surface which impedes one-dimensional growth over a wide temperature range i.e. 300–800 °C. This was overcome by the addition of ammonium chloride (NH<sub>4</sub>Cl) which undergoes sublimation at 338 °C thereby releasing NH<sub>3</sub>and HCl which act as dispersants thereby enhancing the vapour pressure of Sn and the one-dimensional growth of Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>nanowires. In addition to the action of dispersion, Sn reacts with HCl giving SnCl<sub>2</sub>which in turn reacts with NH<sub>3</sub>leading to the formation of Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>NWs. A first estimate of the band-gap of the Sn<sub> <it>x</it> </sub>N<sub> <it>y</it> </sub>nanowires grown on Si(111) was obtained from optical reflection measurements and found to be ≈2.6 eV. Finally, intricate assemblies of nanowires were also obtained at lower growth temperatures.</p> |
---|---|
ISSN: | 1931-7573 1556-276X |