A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite e...
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doaj-95bf6315ffe64cff9f700a47d65acc9e2020-11-25T01:02:25ZengMDPI AGElectronics2079-92922018-12-0171243810.3390/electronics7120438electronics7120438A Novel Moisture Diffusion Modeling Approach Using Finite Element AnalysisCagan Diyaroglu0Erdogan Madenci1Selda Oterkus2Erkan Oterkus3Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, USADepartment of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, USADepartment of Naval Architecture, Ocean and Marine Engineering, University of Strathclyde, Glasgow G4 0LZ, UKDepartment of Naval Architecture, Ocean and Marine Engineering, University of Strathclyde, Glasgow G4 0LZ, UKIn this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.https://www.mdpi.com/2079-9292/7/12/438moisturediffusionfinite elementwetnessconcentration |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Cagan Diyaroglu Erdogan Madenci Selda Oterkus Erkan Oterkus |
spellingShingle |
Cagan Diyaroglu Erdogan Madenci Selda Oterkus Erkan Oterkus A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis Electronics moisture diffusion finite element wetness concentration |
author_facet |
Cagan Diyaroglu Erdogan Madenci Selda Oterkus Erkan Oterkus |
author_sort |
Cagan Diyaroglu |
title |
A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis |
title_short |
A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis |
title_full |
A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis |
title_fullStr |
A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis |
title_full_unstemmed |
A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis |
title_sort |
novel moisture diffusion modeling approach using finite element analysis |
publisher |
MDPI AG |
series |
Electronics |
issn |
2079-9292 |
publishDate |
2018-12-01 |
description |
In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions. |
topic |
moisture diffusion finite element wetness concentration |
url |
https://www.mdpi.com/2079-9292/7/12/438 |
work_keys_str_mv |
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1725205140355416064 |