A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis

In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite e...

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Main Authors: Cagan Diyaroglu, Erdogan Madenci, Selda Oterkus, Erkan Oterkus
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Electronics
Subjects:
Online Access:https://www.mdpi.com/2079-9292/7/12/438
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spelling doaj-95bf6315ffe64cff9f700a47d65acc9e2020-11-25T01:02:25ZengMDPI AGElectronics2079-92922018-12-0171243810.3390/electronics7120438electronics7120438A Novel Moisture Diffusion Modeling Approach Using Finite Element AnalysisCagan Diyaroglu0Erdogan Madenci1Selda Oterkus2Erkan Oterkus3Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, USADepartment of Aerospace and Mechanical Engineering, University of Arizona, Tucson, AZ 85721, USADepartment of Naval Architecture, Ocean and Marine Engineering, University of Strathclyde, Glasgow G4 0LZ, UKDepartment of Naval Architecture, Ocean and Marine Engineering, University of Strathclyde, Glasgow G4 0LZ, UKIn this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.https://www.mdpi.com/2079-9292/7/12/438moisturediffusionfinite elementwetnessconcentration
collection DOAJ
language English
format Article
sources DOAJ
author Cagan Diyaroglu
Erdogan Madenci
Selda Oterkus
Erkan Oterkus
spellingShingle Cagan Diyaroglu
Erdogan Madenci
Selda Oterkus
Erkan Oterkus
A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
Electronics
moisture
diffusion
finite element
wetness
concentration
author_facet Cagan Diyaroglu
Erdogan Madenci
Selda Oterkus
Erkan Oterkus
author_sort Cagan Diyaroglu
title A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
title_short A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
title_full A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
title_fullStr A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
title_full_unstemmed A Novel Moisture Diffusion Modeling Approach Using Finite Element Analysis
title_sort novel moisture diffusion modeling approach using finite element analysis
publisher MDPI AG
series Electronics
issn 2079-9292
publishDate 2018-12-01
description In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.
topic moisture
diffusion
finite element
wetness
concentration
url https://www.mdpi.com/2079-9292/7/12/438
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