Yang, H., Chen, Q., Wang, X., Chi, M., Liu, H., & Ning, X. (2019). Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. MDPI AG.
Chicago Style (17th ed.) CitationYang, Hongda, Qingguo Chen, Xinyu Wang, Minghe Chi, Heqian Liu, and Xin Ning. Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. MDPI AG, 2019.
MLA (8th ed.) CitationYang, Hongda, et al. Dielectric and Thermal Conductivity of Epoxy Resin Impregnated Nano-h-BN Modified Insulating Paper. MDPI AG, 2019.
Warning: These citations may not always be 100% accurate.