Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review
The significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the hig...
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doaj-9aeb15ae3b06455db906eedd11f2217f2020-11-25T00:25:38ZengMDPI AGMicromachines2072-666X2019-06-0110640610.3390/mi10060406mi10060406Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical ReviewXiaorui Guo0Qian Xun1Zuxin Li2Shuxin Du3School of Engineering, Huzhou University, Erhuan Road 759, Huzhou, ChinaDepartment of Electrical Engineering, Chalmers University of Technology, 313000 Göteborg, SwedenSchool of Engineering, Huzhou University, Erhuan Road 759, Huzhou, ChinaSchool of Engineering, Huzhou University, Erhuan Road 759, Huzhou, ChinaThe significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC−DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.https://www.mdpi.com/2072-666X/10/6/406power electronicshigh-temperature convertersMEMS devicesSiC power electronic devices |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Xiaorui Guo Qian Xun Zuxin Li Shuxin Du |
spellingShingle |
Xiaorui Guo Qian Xun Zuxin Li Shuxin Du Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review Micromachines power electronics high-temperature converters MEMS devices SiC power electronic devices |
author_facet |
Xiaorui Guo Qian Xun Zuxin Li Shuxin Du |
author_sort |
Xiaorui Guo |
title |
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review |
title_short |
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review |
title_full |
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review |
title_fullStr |
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review |
title_full_unstemmed |
Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review |
title_sort |
silicon carbide converters and mems devices for high-temperature power electronics: a critical review |
publisher |
MDPI AG |
series |
Micromachines |
issn |
2072-666X |
publishDate |
2019-06-01 |
description |
The significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC−DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology. |
topic |
power electronics high-temperature converters MEMS devices SiC power electronic devices |
url |
https://www.mdpi.com/2072-666X/10/6/406 |
work_keys_str_mv |
AT xiaoruiguo siliconcarbideconvertersandmemsdevicesforhightemperaturepowerelectronicsacriticalreview AT qianxun siliconcarbideconvertersandmemsdevicesforhightemperaturepowerelectronicsacriticalreview AT zuxinli siliconcarbideconvertersandmemsdevicesforhightemperaturepowerelectronicsacriticalreview AT shuxindu siliconcarbideconvertersandmemsdevicesforhightemperaturepowerelectronicsacriticalreview |
_version_ |
1725347820983025664 |