Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography

• Main Authors: Youwei Jiang, Bingqing Luo, Xing Cheng
• Format: Article
• Language: English
• Published: MDPI AG 2019-02-01
• Series: Materials
• Subjects: thermal nanoimprint; polymer patterning; polymer reflow; step-and-repeat nanoimprint
• Online Access: https://www.mdpi.com/1996-1944/12/3/545

Thermoplastic polymer micro- and nanostructures suffer pattern decay when heated to a temperature close to or above the polymer’s glass transition temperature. In this work, we report enhanced thermal stability of polycarbonate nanostructures at temperatures well above their glass transition temperatures. Based on this observation, we develop a unique technique for high-resolution polymer patterning by polymer reflows. This technique is characterized as the precise control of polymer reflows regardless of the annealing time, which avoids the time-domain nonlinear reflow of the polymer melt. We also implement thermal nanoimprinting in a step-and-repeat fashion, which dramatically increases the throughput of the thermal nanoimprint. The enhanced pattern stability against thermal reflow also allows for multiple imprinting at the same location to generate complex resist patterns from a simple mold structure. Since modern lithography often uses thin resist films (sub-100 nm) due to the restraint from the pattern aspect ratio, the unusual annealing behavior of thin polymer films is highly relevant in sub-100 nm lithographic processing.