Thermal- and Performance-Aware Address Mapping for the Multi-Channel Three-Dimensional DRAM Systems
In this paper, we proposed thermal- and performance-aware address mapping (TPAMAP) for the multi-channel 3-D DRAM systems. TPAMAP reduces the thermal problem from the vertical stacking of the active banks in different DRAM channels and supports the mappings with the design tradeoffs of the temperatu...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2017-01-01
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Series: | IEEE Access |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/7891039/ |