Thermal- and Performance-Aware Address Mapping for the Multi-Channel Three-Dimensional DRAM Systems
In this paper, we proposed thermal- and performance-aware address mapping (TPAMAP) for the multi-channel 3-D DRAM systems. TPAMAP reduces the thermal problem from the vertical stacking of the active banks in different DRAM channels and supports the mappings with the design tradeoffs of the temperatu...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2017-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7891039/ |