Dataset of spark plasma sintering of AlZnSn alloy for soft solder application

The conventional soft solder used in soldering electronic joints is made up of 63% Sn and 37% Pb. It has been established that Pb is harmful to the body. Therefore, there is an on-going research to find a replacement for Pb. AlZnSn alloy is considered here as a possible replacement for soft solder...

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Main Authors: O.P. Oladijo, A.P.I. Popoola, C.O. Ujah, M. Namoshe
Format: Article
Language:English
Published: Elsevier 2019-06-01
Series:Data in Brief
Online Access:http://www.sciencedirect.com/science/article/pii/S2352340919302999
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spelling doaj-adcb36b93c144c3ea8496bc5628bc72e2020-11-25T00:03:07ZengElsevierData in Brief2352-34092019-06-0124Dataset of spark plasma sintering of AlZnSn alloy for soft solder applicationO.P. Oladijo0A.P.I. Popoola1C.O. Ujah2M. Namoshe3Department of Chemical, Materials and Metallurgical Engineering, Botswana International University of Science and Technology, Palapye, Botswana; Mechanical Engineering Science Department, University of Johannesburg, Auckland Park Kingsway Campus, Johannesburg, South Africa; Corresponding author. Department of Chemical, Materials and Metallurgical Engineering, Botswana International University of Science and Technology, Palapye, Botswana.Department of Chemical, Metallurgical and Materials Engineering, Tshwane University of Technology, Pretoria, South AfricaDepartment of Chemical, Metallurgical and Materials Engineering, Tshwane University of Technology, Pretoria, South AfricaDepartment of Mechanical, Energy and Industrial Engineering, Botswana International University of Science and Technology, Palapye, BotswanaThe conventional soft solder used in soldering electronic joints is made up of 63% Sn and 37% Pb. It has been established that Pb is harmful to the body. Therefore, there is an on-going research to find a replacement for Pb. AlZnSn alloy is considered here as a possible replacement for soft solder of Sn and Pb. Three compositions of the alloy (Al7Zn3Sn, Al10Zn5Sn, and Al13Zn7Sn) were sintered at the sintering temperatures of 300 °C and 350 °C (and the constant pressure of 40 MPa, time of 5 mins, a heating rate of 20 °C/mins). Temperature/displacement/time variation data during the sintering were collected. The three alloys were compared after sintering by checking their microstructure, their densities, their hardness, their porosity, and their tensile strengths. Results showed that Al13Zn7Sn sintered at 350 °C, 40 MPa, 5 mins, 20 °C/mins had the highest densification of 99.7%, the lowest porosity of 0.3%, least hardness and strength of 450.34 MPa and 147.84 MPa respectively. Keywords: Spark plasma sintering, Soft solder, Micro hardness, Aluminium, Tin, Zinchttp://www.sciencedirect.com/science/article/pii/S2352340919302999
collection DOAJ
language English
format Article
sources DOAJ
author O.P. Oladijo
A.P.I. Popoola
C.O. Ujah
M. Namoshe
spellingShingle O.P. Oladijo
A.P.I. Popoola
C.O. Ujah
M. Namoshe
Dataset of spark plasma sintering of AlZnSn alloy for soft solder application
Data in Brief
author_facet O.P. Oladijo
A.P.I. Popoola
C.O. Ujah
M. Namoshe
author_sort O.P. Oladijo
title Dataset of spark plasma sintering of AlZnSn alloy for soft solder application
title_short Dataset of spark plasma sintering of AlZnSn alloy for soft solder application
title_full Dataset of spark plasma sintering of AlZnSn alloy for soft solder application
title_fullStr Dataset of spark plasma sintering of AlZnSn alloy for soft solder application
title_full_unstemmed Dataset of spark plasma sintering of AlZnSn alloy for soft solder application
title_sort dataset of spark plasma sintering of alznsn alloy for soft solder application
publisher Elsevier
series Data in Brief
issn 2352-3409
publishDate 2019-06-01
description The conventional soft solder used in soldering electronic joints is made up of 63% Sn and 37% Pb. It has been established that Pb is harmful to the body. Therefore, there is an on-going research to find a replacement for Pb. AlZnSn alloy is considered here as a possible replacement for soft solder of Sn and Pb. Three compositions of the alloy (Al7Zn3Sn, Al10Zn5Sn, and Al13Zn7Sn) were sintered at the sintering temperatures of 300 °C and 350 °C (and the constant pressure of 40 MPa, time of 5 mins, a heating rate of 20 °C/mins). Temperature/displacement/time variation data during the sintering were collected. The three alloys were compared after sintering by checking their microstructure, their densities, their hardness, their porosity, and their tensile strengths. Results showed that Al13Zn7Sn sintered at 350 °C, 40 MPa, 5 mins, 20 °C/mins had the highest densification of 99.7%, the lowest porosity of 0.3%, least hardness and strength of 450.34 MPa and 147.84 MPa respectively. Keywords: Spark plasma sintering, Soft solder, Micro hardness, Aluminium, Tin, Zinc
url http://www.sciencedirect.com/science/article/pii/S2352340919302999
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