Asymptotic solutions for buckling delamination induced crack propagation in the thin film-compliant substrate system
In a thin film-substrate system in-plane compressive stress is commonly generated in the film due to thermal mismatch in operation or fabrication process. If the stress exceeds a critical value, part of the film may buckle out of plane along the defective interface. After buckling delamination, the...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2014-01-01
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| Series: | Theoretical and Applied Mechanics Letters |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S209503491530324X |