Identifying best parameters of particleboard bonded with dextrin-based adhesives
The objective of this study was to evaluate the best parameters of particleboard manufacturing throughout the physical and mechanical properties’ test under Japanese Industrial Standard. Particleboard panels were manufactured from veneer waste of sengon wood (Paraserianthes moluccana) bonded with de...
Main Authors: | Alamsyah Eka Mulya, Sutrisno, Nuryawan Arif, Widyorini Ragil |
---|---|
Format: | Article |
Language: | English |
Published: |
De Gruyter
2020-07-01
|
Series: | Open Agriculture |
Subjects: | |
Online Access: | https://doi.org/10.1515/opag-2020-0037 |
Similar Items
-
Bonding Ability of a New Adhesive Composed of Citric Acid-Sucrose for Particleboard
by: Ragil Widyorini, et al.
Published: (2016-04-01) -
STRAW BASED PARTICLEBOARD BONDED WITH COMPOSITE ADHESIVES
by: Mingwei Di, et al.
Published: (2011-02-01) -
Use of Soy Flour-Tannin Adhesive for Particleboard (Dry Condition)
by: Saman Ghahri, et al.
Published: (2017-05-01) -
The manufacture of particleboard using tannin-modified urea
formaldehyde adhesive
by: ُSima Sepahvand, et al.
Published: (2013-06-01) -
Some physicochemical properties of dextrin produced by extrusion process
by: Achmat Sarifudin, et al.
Published: (2014-06-01)