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Inspection of Packaged Integrated Circuits using Terahertz Radiation

Inspection of Packaged Integrated Circuits using Terahertz Radiation

Bibliographic Details
Main Authors: Andreas Fritz, Thomas Arnold
Format: Article
Language:English
Published: Exeley Inc. 2014-12-01
Series:International Journal on Smart Sensing and Intelligent Systems
Subjects:
terahertz; Time domain spectroscopy; Wavelet transformation; Wavelet denosing; packaged integrated circuit inspection
Online Access:https://www.exeley.com/exeley/journals/in_jour_smart_sensing_and_intelligent_systems/7/5/pdf/10.21307_ijssis-2019-056.pdf
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Internet

https://www.exeley.com/exeley/journals/in_jour_smart_sensing_and_intelligent_systems/7/5/pdf/10.21307_ijssis-2019-056.pdf

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