Investigation of the thermal tolerance of silicon-based lateral spin valves
Abstract Improvement in the thermal tolerance of Si-based spin devices is realized by employing thermally stable nonmagnetic (NM) electrodes. For Au/Ta/Al electrodes, intermixing between Al atoms and Au atoms occurs at approximately 300 °C, resulting in the formation of a Au/Si interface. The Au–Si...
Main Authors: | N. Yamashita, S. Lee, R. Ohshima, E. Shigematsu, H. Koike, Y. Suzuki, S. Miwa, M. Goto, Y. Ando, M. Shiraishi |
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Format: | Article |
Language: | English |
Published: |
Nature Publishing Group
2021-05-01
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Series: | Scientific Reports |
Online Access: | https://doi.org/10.1038/s41598-021-90114-9 |
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