Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent charac...
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MDPI AG
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doaj-c514f71c5ae149c5bf3072a08606eae52021-03-11T00:06:56ZengMDPI AGMicromachines2072-666X2021-03-011229529510.3390/mi12030295Reliability Evaluation of Fan-Out Type 3D Packaging-On-PackagingP. H. Wang0Y. W. Huang1K. N. Chiang2Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, TaiwanDepartment of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, TaiwanDepartment of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, TaiwanThe development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP.https://www.mdpi.com/2072-666X/12/3/295fan-out wafer-level packagefinite elementglass substratereliability lifepackaging-on-packaging |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
P. H. Wang Y. W. Huang K. N. Chiang |
spellingShingle |
P. H. Wang Y. W. Huang K. N. Chiang Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging Micromachines fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging |
author_facet |
P. H. Wang Y. W. Huang K. N. Chiang |
author_sort |
P. H. Wang |
title |
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging |
title_short |
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging |
title_full |
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging |
title_fullStr |
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging |
title_full_unstemmed |
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging |
title_sort |
reliability evaluation of fan-out type 3d packaging-on-packaging |
publisher |
MDPI AG |
series |
Micromachines |
issn |
2072-666X |
publishDate |
2021-03-01 |
description |
The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent characteristics, glass is a good material for high-speed transmission applications. Therefore, this study proposes a fan-out wafer-level packaging (FO-WLP) with glass substrate-type PoP. The reliability life of the proposed FO-WLP was evaluated under thermal cycling conditions through finite element simulations and empirical calculations. Considering the simulation processing time and consistency with the experimentally obtained mean time to failure (MTTF) of the packaging, both two- and three-dimensional finite element models were developed with appropriate mechanical theories, and were verified to have similar MTTFs. Next, the FO-WLP structure was optimized by simulating various design parameters. The coefficient of thermal expansion of the glass substrate exerted the strongest effect on the reliability life under thermal cycling loading. In addition, the upper and lower pad thicknesses and the buffer layer thickness significantly affected the reliability life of both the FO-WLP and the FO-WLP-type PoP. |
topic |
fan-out wafer-level package finite element glass substrate reliability life packaging-on-packaging |
url |
https://www.mdpi.com/2072-666X/12/3/295 |
work_keys_str_mv |
AT phwang reliabilityevaluationoffanouttype3dpackagingonpackaging AT ywhuang reliabilityevaluationoffanouttype3dpackagingonpackaging AT knchiang reliabilityevaluationoffanouttype3dpackagingonpackaging |
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