Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packaging (PoP) architecture. Given its inherent charac...
Main Authors: | P. H. Wang, Y. W. Huang, K. N. Chiang |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-03-01
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Series: | Micromachines |
Subjects: | |
Online Access: | https://www.mdpi.com/2072-666X/12/3/295 |
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