Editorial: Novel Materials for Green Soldering and Brazing

Bibliographic Details
Main Authors: M. A. Fazal, Liang Zhang, Xingxing Wang, Guang Zeng
Format: Article
Language:English
Published: Frontiers Media S.A. 2021-09-01
Series:Frontiers in Materials
Subjects:
Online Access:https://www.frontiersin.org/articles/10.3389/fmats.2021.747312/full
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spelling doaj-c660944a188546e5a351188913512ff02021-09-08T04:55:18ZengFrontiers Media S.A.Frontiers in Materials2296-80162021-09-01810.3389/fmats.2021.747312747312Editorial: Novel Materials for Green Soldering and BrazingM. A. Fazal0Liang Zhang1Xingxing Wang2Guang Zeng3Department of Mechanical and Materials Engineering, Faculty of Engineering, University of Jeddah, Jeddah, Saudi ArabiaSchool of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, ChinaNorth China University of Water Conservancy and Electric Power, Zhengzhou, ChinaCentral South University, Changsha, Chinahttps://www.frontiersin.org/articles/10.3389/fmats.2021.747312/fullPb free solderCd-free fillerinterconnectionfabricationelectronic devices and packaging
collection DOAJ
language English
format Article
sources DOAJ
author M. A. Fazal
Liang Zhang
Xingxing Wang
Guang Zeng
spellingShingle M. A. Fazal
Liang Zhang
Xingxing Wang
Guang Zeng
Editorial: Novel Materials for Green Soldering and Brazing
Frontiers in Materials
Pb free solder
Cd-free filler
interconnection
fabrication
electronic devices and packaging
author_facet M. A. Fazal
Liang Zhang
Xingxing Wang
Guang Zeng
author_sort M. A. Fazal
title Editorial: Novel Materials for Green Soldering and Brazing
title_short Editorial: Novel Materials for Green Soldering and Brazing
title_full Editorial: Novel Materials for Green Soldering and Brazing
title_fullStr Editorial: Novel Materials for Green Soldering and Brazing
title_full_unstemmed Editorial: Novel Materials for Green Soldering and Brazing
title_sort editorial: novel materials for green soldering and brazing
publisher Frontiers Media S.A.
series Frontiers in Materials
issn 2296-8016
publishDate 2021-09-01
topic Pb free solder
Cd-free filler
interconnection
fabrication
electronic devices and packaging
url https://www.frontiersin.org/articles/10.3389/fmats.2021.747312/full
work_keys_str_mv AT mafazal editorialnovelmaterialsforgreensolderingandbrazing
AT liangzhang editorialnovelmaterialsforgreensolderingandbrazing
AT xingxingwang editorialnovelmaterialsforgreensolderingandbrazing
AT guangzeng editorialnovelmaterialsforgreensolderingandbrazing
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