<i>Aspergillus foetidus</i> Regulated the Biochemical Characteristics of Soybean and Sunflower under Heat Stress Condition: Role in Sustainability

Plants are susceptible to various environmental constrains, including heat stress due to their sessile nature. Endophytic fungi can be used as a novel technique to protect crop plants against the injurious effects of thermal stress. Endophytic fungi were isolated from <i>Adiantum capillus-vene...

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Bibliographic Details
Main Authors: Ismail, Muhammad Hamayun, Anwar Hussain, Amjad Iqbal, Sumera Afzal Khan, Ayaz Ahmad, Sarah Gul, Ho-Youn Kim, In-Jung Lee
Format: Article
Language:English
Published: MDPI AG 2021-06-01
Series:Sustainability
Subjects:
ROS
Online Access:https://www.mdpi.com/2071-1050/13/13/7159
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Summary:Plants are susceptible to various environmental constrains, including heat stress due to their sessile nature. Endophytic fungi can be used as a novel technique to protect crop plants against the injurious effects of thermal stress. Endophytic fungi were isolated from <i>Adiantum capillus-veneris</i> L. and tested against heat stress in <i>Glycine max</i> L. and <i>Helianthus annuus</i> L. The results exhibited increased levels of the plant’s chlorophyll, height and biomass in <i>Aspergillus foetidus</i> (AdR-13) inoculated host crop species. Conversely, a significant decrease in lipid peroxidation and reactive oxygen species (ROS) production was noted in <i>A. foetidus</i>-associated host crop species. Likewise, the amounts of ROS-degrading antioxidants (glutathione reductase (GR), peroxidase (POD), ascorbic acid oxidase (AAO), superoxide dismutase (SOD), catalase (CAT)) as well as phenolics were increased, while the amounts of proline and abscisic acid (ABA) were decreased in fungal-associated test crops. Total lipids, proteins and sugars were noted to be high in <i>A. foetidus</i>-associated test crops. From the results, we concluded that <i>A. foetidus</i> have a role in heat stress mitigation that might help to sustain the production of important crops in the future.
ISSN:2071-1050