Review of Health Prognostics and Condition Monitoring of Electronic Components

To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past developm...

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Main Authors: Cherry Bhargava, Pardeep Kumar Sharma, Mohan Senthilkumar, Sanjeevikumar Padmanaban, Vigna K. Ramachandaramurthy, Zbigniew Leonowicz, Frede Blaabjerg, Massimo Mitolo
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9075164/
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spelling doaj-ccca659e74e54783bcda365a517cfb842021-08-17T23:00:24ZengIEEEIEEE Access2169-35362020-01-018751637518310.1109/ACCESS.2020.29894109075164Review of Health Prognostics and Condition Monitoring of Electronic ComponentsCherry Bhargava0Pardeep Kumar Sharma1Mohan Senthilkumar2https://orcid.org/0000-0002-8114-3147Sanjeevikumar Padmanaban3https://orcid.org/0000-0003-3212-2750Vigna K. Ramachandaramurthy4Zbigniew Leonowicz5Frede Blaabjerg6https://orcid.org/0000-0001-8311-7412Massimo Mitolo7School of Electrical and Electronics Engineering, Lovely Professional University, Phagwara, IndiaSchool of PS, Lovely Professional University, Phagwara, IndiaSchool of Information Technology and Engineering, Vellore Institute of Technology, Vellore, IndiaDepartment of Energy Technology, Aalborg University, Aalborg, DenmarkInstitute of Power Engineering, Department of Electrical Power Engineering, College of Engineering, Universiti Tenaga Nasional, Jalan Ikram-Uniten, Kajang, MalaysiaFaculty of Electrical Engineering, Wrocław University of Science and Technology, Wrocław, PolandDepartment of Energy Technology, Aalborg University, Aalborg, DenmarkSchool of Integrated Design, Engineering and Automation, Irvine Valley College, Irvine, CA, USATo meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted.https://ieeexplore.ieee.org/document/9075164/Reliability methodscondition monitoringfaults and failuresprognosticsdiagnostics
collection DOAJ
language English
format Article
sources DOAJ
author Cherry Bhargava
Pardeep Kumar Sharma
Mohan Senthilkumar
Sanjeevikumar Padmanaban
Vigna K. Ramachandaramurthy
Zbigniew Leonowicz
Frede Blaabjerg
Massimo Mitolo
spellingShingle Cherry Bhargava
Pardeep Kumar Sharma
Mohan Senthilkumar
Sanjeevikumar Padmanaban
Vigna K. Ramachandaramurthy
Zbigniew Leonowicz
Frede Blaabjerg
Massimo Mitolo
Review of Health Prognostics and Condition Monitoring of Electronic Components
IEEE Access
Reliability methods
condition monitoring
faults and failures
prognostics
diagnostics
author_facet Cherry Bhargava
Pardeep Kumar Sharma
Mohan Senthilkumar
Sanjeevikumar Padmanaban
Vigna K. Ramachandaramurthy
Zbigniew Leonowicz
Frede Blaabjerg
Massimo Mitolo
author_sort Cherry Bhargava
title Review of Health Prognostics and Condition Monitoring of Electronic Components
title_short Review of Health Prognostics and Condition Monitoring of Electronic Components
title_full Review of Health Prognostics and Condition Monitoring of Electronic Components
title_fullStr Review of Health Prognostics and Condition Monitoring of Electronic Components
title_full_unstemmed Review of Health Prognostics and Condition Monitoring of Electronic Components
title_sort review of health prognostics and condition monitoring of electronic components
publisher IEEE
series IEEE Access
issn 2169-3536
publishDate 2020-01-01
description To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted.
topic Reliability methods
condition monitoring
faults and failures
prognostics
diagnostics
url https://ieeexplore.ieee.org/document/9075164/
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