Review of Health Prognostics and Condition Monitoring of Electronic Components
To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past developm...
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doaj-ccca659e74e54783bcda365a517cfb842021-08-17T23:00:24ZengIEEEIEEE Access2169-35362020-01-018751637518310.1109/ACCESS.2020.29894109075164Review of Health Prognostics and Condition Monitoring of Electronic ComponentsCherry Bhargava0Pardeep Kumar Sharma1Mohan Senthilkumar2https://orcid.org/0000-0002-8114-3147Sanjeevikumar Padmanaban3https://orcid.org/0000-0003-3212-2750Vigna K. Ramachandaramurthy4Zbigniew Leonowicz5Frede Blaabjerg6https://orcid.org/0000-0001-8311-7412Massimo Mitolo7School of Electrical and Electronics Engineering, Lovely Professional University, Phagwara, IndiaSchool of PS, Lovely Professional University, Phagwara, IndiaSchool of Information Technology and Engineering, Vellore Institute of Technology, Vellore, IndiaDepartment of Energy Technology, Aalborg University, Aalborg, DenmarkInstitute of Power Engineering, Department of Electrical Power Engineering, College of Engineering, Universiti Tenaga Nasional, Jalan Ikram-Uniten, Kajang, MalaysiaFaculty of Electrical Engineering, Wrocław University of Science and Technology, Wrocław, PolandDepartment of Energy Technology, Aalborg University, Aalborg, DenmarkSchool of Integrated Design, Engineering and Automation, Irvine Valley College, Irvine, CA, USATo meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted.https://ieeexplore.ieee.org/document/9075164/Reliability methodscondition monitoringfaults and failuresprognosticsdiagnostics |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Cherry Bhargava Pardeep Kumar Sharma Mohan Senthilkumar Sanjeevikumar Padmanaban Vigna K. Ramachandaramurthy Zbigniew Leonowicz Frede Blaabjerg Massimo Mitolo |
spellingShingle |
Cherry Bhargava Pardeep Kumar Sharma Mohan Senthilkumar Sanjeevikumar Padmanaban Vigna K. Ramachandaramurthy Zbigniew Leonowicz Frede Blaabjerg Massimo Mitolo Review of Health Prognostics and Condition Monitoring of Electronic Components IEEE Access Reliability methods condition monitoring faults and failures prognostics diagnostics |
author_facet |
Cherry Bhargava Pardeep Kumar Sharma Mohan Senthilkumar Sanjeevikumar Padmanaban Vigna K. Ramachandaramurthy Zbigniew Leonowicz Frede Blaabjerg Massimo Mitolo |
author_sort |
Cherry Bhargava |
title |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_short |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_full |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_fullStr |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_full_unstemmed |
Review of Health Prognostics and Condition Monitoring of Electronic Components |
title_sort |
review of health prognostics and condition monitoring of electronic components |
publisher |
IEEE |
series |
IEEE Access |
issn |
2169-3536 |
publishDate |
2020-01-01 |
description |
To meet the specifications of low cost, highly reliable electronic devices, fault diagnosis techniques play an essential role. It is vital to find flaws at an early stage in design, components, material, or manufacturing during the initial phase. This review paper attempts to summarize past development and recent advances in the areas about green manufacturing, maintenance, remaining useful life (RUL) prediction, and like. The current state of the art in reliability research for electronic components, mainly includes failure mechanisms, condition monitoring, and residual lifetime evaluation is explored. A critical analysis of reliability studies to identify their relative merits and usefulness of the outcome of these studies' vis-a-vis green manufacturing is presented. The wide array of statistical, empirical, and intelligent tools and techniques used in the literature are then identified and mapped. Finally, the findings are summarized, and the central research gap is highlighted. |
topic |
Reliability methods condition monitoring faults and failures prognostics diagnostics |
url |
https://ieeexplore.ieee.org/document/9075164/ |
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