A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input

The ability to predict the grinding force for hard and brittle materials is important to optimize and control the grinding process. However, it is a difficult task to establish a comprehensive grinding force model that takes into account the brittle fracture, grinding conditions, and random distribu...

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Main Authors: Zhipeng Li, Feihu Zhang, Xichun Luo, Xiaoguang Guo, Yukui Cai, Wenlong Chang, Jining Sun
Format: Article
Language:English
Published: MDPI AG 2018-07-01
Series:Micromachines
Subjects:
Online Access:http://www.mdpi.com/2072-666X/9/8/368
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spelling doaj-dc1e9476f63941b09002df214f9b7ee22020-11-24T21:12:36ZengMDPI AGMicromachines2072-666X2018-07-019836810.3390/mi9080368mi9080368A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an InputZhipeng Li0Feihu Zhang1Xichun Luo2Xiaoguang Guo3Yukui Cai4Wenlong Chang5Jining Sun6School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, ChinaSchool of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, ChinaCentre for Precision Manufacturing, Design, Manufacture & Engineering Management, University of Strathclyde, Glasgow G1 1XJ, UKKey Laboratory for Precision and Non-Traditional Machining Technology, Dalian University of Technology, Dalian 116024, ChinaCentre for Precision Manufacturing, Design, Manufacture & Engineering Management, University of Strathclyde, Glasgow G1 1XJ, UKCentre for Precision Manufacturing, Design, Manufacture & Engineering Management, University of Strathclyde, Glasgow G1 1XJ, UKSchool of Engineering and Physical Science, Heriot Wat University, Edinburgh EH14 4AS, UKThe ability to predict the grinding force for hard and brittle materials is important to optimize and control the grinding process. However, it is a difficult task to establish a comprehensive grinding force model that takes into account the brittle fracture, grinding conditions, and random distribution of the grinding wheel topography. Therefore, this study developed a new grinding force model for micro-grinding of reaction-bonded silicon carbide (RB-SiC) ceramics. First, the grinding force components and grinding trajectory were analysed based on the critical depth of rubbing, ploughing, and brittle fracture. Afterwards, the corresponding individual grain force were established and the total grinding force was derived through incorporating the single grain force with dynamic cutting grains. Finally, a series of calibration and validation experiments were conducted to obtain the empirical coefficient and verify the accuracy of the model. It was found that ploughing and fracture were the dominate removal modes, which illustrate that the force components decomposed are correct. Furthermore, the values predicted according to the proposed model are consistent with the experimental data, with the average deviation of 6.793% and 8.926% for the normal and tangential force, respectively. This suggests that the proposed model is acceptable and can be used to simulate the grinding force for RB-SiC ceramics in practice.http://www.mdpi.com/2072-666X/9/8/368grinding force modelrubbingplasticbrittle fractureprotrusion height
collection DOAJ
language English
format Article
sources DOAJ
author Zhipeng Li
Feihu Zhang
Xichun Luo
Xiaoguang Guo
Yukui Cai
Wenlong Chang
Jining Sun
spellingShingle Zhipeng Li
Feihu Zhang
Xichun Luo
Xiaoguang Guo
Yukui Cai
Wenlong Chang
Jining Sun
A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
Micromachines
grinding force model
rubbing
plastic
brittle fracture
protrusion height
author_facet Zhipeng Li
Feihu Zhang
Xichun Luo
Xiaoguang Guo
Yukui Cai
Wenlong Chang
Jining Sun
author_sort Zhipeng Li
title A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
title_short A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
title_full A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
title_fullStr A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
title_full_unstemmed A New Grinding Force Model for Micro Grinding RB-SiC Ceramic with Grinding Wheel Topography as an Input
title_sort new grinding force model for micro grinding rb-sic ceramic with grinding wheel topography as an input
publisher MDPI AG
series Micromachines
issn 2072-666X
publishDate 2018-07-01
description The ability to predict the grinding force for hard and brittle materials is important to optimize and control the grinding process. However, it is a difficult task to establish a comprehensive grinding force model that takes into account the brittle fracture, grinding conditions, and random distribution of the grinding wheel topography. Therefore, this study developed a new grinding force model for micro-grinding of reaction-bonded silicon carbide (RB-SiC) ceramics. First, the grinding force components and grinding trajectory were analysed based on the critical depth of rubbing, ploughing, and brittle fracture. Afterwards, the corresponding individual grain force were established and the total grinding force was derived through incorporating the single grain force with dynamic cutting grains. Finally, a series of calibration and validation experiments were conducted to obtain the empirical coefficient and verify the accuracy of the model. It was found that ploughing and fracture were the dominate removal modes, which illustrate that the force components decomposed are correct. Furthermore, the values predicted according to the proposed model are consistent with the experimental data, with the average deviation of 6.793% and 8.926% for the normal and tangential force, respectively. This suggests that the proposed model is acceptable and can be used to simulate the grinding force for RB-SiC ceramics in practice.
topic grinding force model
rubbing
plastic
brittle fracture
protrusion height
url http://www.mdpi.com/2072-666X/9/8/368
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