Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys

An experimental study has been carried out to evaluate the microstructural and microhardness evolution on the directionally solidified binary Al-Cu and multicomponent Al-Cu-Si alloys and the influence of Si alloying. For this purpose specimens of Al-6wt.%Cu and Al-6wt.%Cu-8wt.%Si alloys were prepare...

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Main Authors: ANGELA J. VASCONCELOS, RAFAEL H. KIKUCHI, ANDRÉ S. BARROS, THIAGO A. COSTA, MARCELINO DIAS, ANTONIO L. MOREIRA, ADRINA P. SILVA, OTÁVIO L. ROCHA
Format: Article
Language:English
Published: Academia Brasileira de Ciências 2016-06-01
Series:Anais da Academia Brasileira de Ciências
Subjects:
Online Access:http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0001-37652016000301099&lng=en&tlng=en
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spelling doaj-dc672b408ee74e6dbf4c1bfdb84796a22020-11-24T23:38:52ZengAcademia Brasileira de CiênciasAnais da Academia Brasileira de Ciências1678-26902016-06-018821099111110.1590/0001-3765201620150172S0001-37652016000301099Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloysANGELA J. VASCONCELOSRAFAEL H. KIKUCHIANDRÉ S. BARROSTHIAGO A. COSTAMARCELINO DIASANTONIO L. MOREIRAADRINA P. SILVAOTÁVIO L. ROCHAAn experimental study has been carried out to evaluate the microstructural and microhardness evolution on the directionally solidified binary Al-Cu and multicomponent Al-Cu-Si alloys and the influence of Si alloying. For this purpose specimens of Al-6wt.%Cu and Al-6wt.%Cu-8wt.%Si alloys were prepared and directionally solidified under transient conditions of heat extraction. A water-cooled horizontal directional solidification device was applied. A comprehensive characterization is performed including experimental dendrite tip growth rates (VL) and cooling rates (TR) by measuring Vickers microhardness (HV), optical microscopy and scanning electron microscopy with microanalysis performed by energy dispersive spectrometry (SEM-EDS). The results show, for both studied alloys, the increasing of TR and VL reduced the primary dendrite arm spacing (l1) increasing the microhardness. Furthermore, the incorporation of Si in Al-6wt.%Cu alloy to form the Al-6wt.%Cu-8wt.%Si alloy influenced significantly the microstructure and consequently the microhardness but did not affect the primary dendritic growth law. An analysis on the formation of the columnar to equiaxed transition (CET) is also performed and the results show that the occurrence of CET is not sharp, i.e., the CET in both cases occurs in a zone rather than in a parallel plane to the chill wall, where both columnar and equiaxed grains are be able to exist.http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0001-37652016000301099&lng=en&tlng=ensolidificaçãometais e ligasmicroscopia eletrônicadureza
collection DOAJ
language English
format Article
sources DOAJ
author ANGELA J. VASCONCELOS
RAFAEL H. KIKUCHI
ANDRÉ S. BARROS
THIAGO A. COSTA
MARCELINO DIAS
ANTONIO L. MOREIRA
ADRINA P. SILVA
OTÁVIO L. ROCHA
spellingShingle ANGELA J. VASCONCELOS
RAFAEL H. KIKUCHI
ANDRÉ S. BARROS
THIAGO A. COSTA
MARCELINO DIAS
ANTONIO L. MOREIRA
ADRINA P. SILVA
OTÁVIO L. ROCHA
Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
Anais da Academia Brasileira de Ciências
solidificação
metais e ligas
microscopia eletrônica
dureza
author_facet ANGELA J. VASCONCELOS
RAFAEL H. KIKUCHI
ANDRÉ S. BARROS
THIAGO A. COSTA
MARCELINO DIAS
ANTONIO L. MOREIRA
ADRINA P. SILVA
OTÁVIO L. ROCHA
author_sort ANGELA J. VASCONCELOS
title Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
title_short Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
title_full Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
title_fullStr Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
title_full_unstemmed Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
title_sort interconnection between microstructure and microhardness of directionally solidified binary al-6wt.%cu and multicomponent al-6wt.%cu-8wt.%si alloys
publisher Academia Brasileira de Ciências
series Anais da Academia Brasileira de Ciências
issn 1678-2690
publishDate 2016-06-01
description An experimental study has been carried out to evaluate the microstructural and microhardness evolution on the directionally solidified binary Al-Cu and multicomponent Al-Cu-Si alloys and the influence of Si alloying. For this purpose specimens of Al-6wt.%Cu and Al-6wt.%Cu-8wt.%Si alloys were prepared and directionally solidified under transient conditions of heat extraction. A water-cooled horizontal directional solidification device was applied. A comprehensive characterization is performed including experimental dendrite tip growth rates (VL) and cooling rates (TR) by measuring Vickers microhardness (HV), optical microscopy and scanning electron microscopy with microanalysis performed by energy dispersive spectrometry (SEM-EDS). The results show, for both studied alloys, the increasing of TR and VL reduced the primary dendrite arm spacing (l1) increasing the microhardness. Furthermore, the incorporation of Si in Al-6wt.%Cu alloy to form the Al-6wt.%Cu-8wt.%Si alloy influenced significantly the microstructure and consequently the microhardness but did not affect the primary dendritic growth law. An analysis on the formation of the columnar to equiaxed transition (CET) is also performed and the results show that the occurrence of CET is not sharp, i.e., the CET in both cases occurs in a zone rather than in a parallel plane to the chill wall, where both columnar and equiaxed grains are be able to exist.
topic solidificação
metais e ligas
microscopia eletrônica
dureza
url http://www.scielo.br/scielo.php?script=sci_arttext&pid=S0001-37652016000301099&lng=en&tlng=en
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