Reactive Ion Etching Process of Micro Mechanical Pendulum

• Main Authors: Zhang Wei, Duan Xiaoyan, Qiao Jin, Yue Ping
• Format: Article
• Language: English
• Published: EDP Sciences 2017-01-01
• Series: MATEC Web of Conferences
• Online Access: https://doi.org/10.1051/matecconf/20179507024

This paper describes the reactive ion etching (RIE) technique of micro mechanical pendulum chip. Micro mechanical pendulum chip processed by the RIE has excellent performances and surface of the chip is smoother than the chip by wet etching. Properties of chip are closely associated with the process parameters. Reactive ion etching technique improves the problems such as intricate lateral etching and surface deficiency of the wet etching. On the basis of method and many experiments of the ion etching, relation between etching rate, etching uniformity, sidewall profiles and process parameters was analyzed and a set process parameters with greater etching effect was obtained. The set process parameters includes etching depth 55μm, etching uniformity (U) 0.63% and selectivity (P) 90:1, etching rate (V) 5.75μm/min, verticality of sidewall 90°±1°.