IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique
Intermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstructure and to reinforce the mechanical strength of...
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doaj-e3e1564139424e4b892e43183728ab852021-03-19T07:26:40ZengElsevierJournal of Materials Research and Technology2238-78542021-03-011118951910IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish techniqueC.E. Ho0S.P. Yang1P.T. Lee2C.Y. Lee3C.C. Chen4T.T. Kuo5Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City, 320, Taiwan, R.O.C; Corresponding author.Department of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City, 320, Taiwan, R.O.CDepartment of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City, 320, Taiwan, R.O.CDepartment of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City, 320, Taiwan, R.O.CDepartment of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City, 320, Taiwan, R.O.C; Department of Advanced Materials Science, University College London (UCL), London, UKDepartment of Chemical Engineering & Materials Science, Yuan Ze University, Chungli Dist., Taoyuan City, 320, Taiwan, R.O.C; Taiwan Uyemura Limited Company, Taiwan, R.O.CIntermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstructure and to reinforce the mechanical strength of Sn–Ag–Cu/Cu microelectronic joints through various surface finish coatings, including organic solderability preservative (OSP), immersion Ag (ImAg), immersion Sn (ImSn), Au/Pd (electroless palladium/immersion gold, EPIG), and Au/Pd/Au (IGEPIG) layer(s). We confirmed that the type of surface finish dominated the IMC growth morphology and mechanical characteristics of the Sn–Ag–Cu/Cu solder joints, even though these surface finishes were eliminated in a few seconds of the soldering process. A dense Cu6Sn5 layer with a scallop-like appearance was obtained for the traditional OSP case, while a prismatic, loose Cu6Sn5 microstructure was produced for the alternative cases (metal films). This loose Cu6Sn5 microstructure offered numerous molten solder channels for the in-diffusion of Sn to Cu, retarding undesired Cu3Sn growth at the Cu6Sn5/Cu interface; consequently, a brittle-to-ductile transition in the joint fracture mode with a high shear strength and fracture energy was obtained in the high-speed ball shear (HSBS) test. A significant mechanical reinforcement of the Sn–Ag–Cu/Cu microelectronic joints can be achieved with the replacement of the traditional OSP coating by the newly developed IGEPIG trilayer surface finish.http://www.sciencedirect.com/science/article/pii/S2238785421001551CuSurface finishIGEPIGIMCMolten solder channelHSBS |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
C.E. Ho S.P. Yang P.T. Lee C.Y. Lee C.C. Chen T.T. Kuo |
spellingShingle |
C.E. Ho S.P. Yang P.T. Lee C.Y. Lee C.C. Chen T.T. Kuo IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique Journal of Materials Research and Technology Cu Surface finish IGEPIG IMC Molten solder channel HSBS |
author_facet |
C.E. Ho S.P. Yang P.T. Lee C.Y. Lee C.C. Chen T.T. Kuo |
author_sort |
C.E. Ho |
title |
IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique |
title_short |
IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique |
title_full |
IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique |
title_fullStr |
IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique |
title_full_unstemmed |
IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique |
title_sort |
imc microstructure modification and mechanical reinforcement of sn–ag–cu/cu microelectronic joints through an advanced surface finish technique |
publisher |
Elsevier |
series |
Journal of Materials Research and Technology |
issn |
2238-7854 |
publishDate |
2021-03-01 |
description |
Intermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstructure and to reinforce the mechanical strength of Sn–Ag–Cu/Cu microelectronic joints through various surface finish coatings, including organic solderability preservative (OSP), immersion Ag (ImAg), immersion Sn (ImSn), Au/Pd (electroless palladium/immersion gold, EPIG), and Au/Pd/Au (IGEPIG) layer(s). We confirmed that the type of surface finish dominated the IMC growth morphology and mechanical characteristics of the Sn–Ag–Cu/Cu solder joints, even though these surface finishes were eliminated in a few seconds of the soldering process. A dense Cu6Sn5 layer with a scallop-like appearance was obtained for the traditional OSP case, while a prismatic, loose Cu6Sn5 microstructure was produced for the alternative cases (metal films). This loose Cu6Sn5 microstructure offered numerous molten solder channels for the in-diffusion of Sn to Cu, retarding undesired Cu3Sn growth at the Cu6Sn5/Cu interface; consequently, a brittle-to-ductile transition in the joint fracture mode with a high shear strength and fracture energy was obtained in the high-speed ball shear (HSBS) test. A significant mechanical reinforcement of the Sn–Ag–Cu/Cu microelectronic joints can be achieved with the replacement of the traditional OSP coating by the newly developed IGEPIG trilayer surface finish. |
topic |
Cu Surface finish IGEPIG IMC Molten solder channel HSBS |
url |
http://www.sciencedirect.com/science/article/pii/S2238785421001551 |
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