Investigation of the Thermal Conductivity of Silicon-Base Composites: The Effect of Filler Materials and Characteristic on Thermo-Mechanical Response of Silicon Composite
Thermal conductivity is a key property in many applications from electronic to informatics. The interaction of fillers with Sylgard 184 was studied; this study explores new composites and the influence of metal particles (copper and nickel), carbon-based materials (carbon nanotubes and carbon black)...
Main Authors: | Giacomo Riccucci, Lorenzo Pezzana, Simone Lantean, Alice Tori, Silvia Spriano, Marco Sangermano |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2021-06-01
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Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/11/12/5663 |
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