Self-alignment of Silicon Chips on Wafers: a Numerical Investigation of the Effect of Spreading and Wetting
3D integration is the key to advanced microelectronic systems. Die-to-wafer assembly is a necessary step to reach full integration. Self-assembly methods are promising due to their parallel aspect, which overcomes the main difficulties of the current techniques. Especially promising are the self-ass...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IFSA Publishing, S.L.
2011-12-01
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| Series: | Sensors & Transducers |
| Subjects: | |
| Online Access: | http://www.sensorsportal.com/HTML/DIGEST/december_2011/P_SI_166.pdf |